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首页> 外文期刊>電子情報通信学会技術研究報告. 電子部品·材料. Component Parts and Materials >Deposition of Microcrystalline SiGe by Magnetron Sputtering on SiO_2 Substrates
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Deposition of Microcrystalline SiGe by Magnetron Sputtering on SiO_2 Substrates

机译:磁控溅射在SiO_2衬底上沉积微晶SiGe

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摘要

Microcrystalline Si_(1-x)Ge_x (x~0.8) has been successfully deposited over SiO_2 substrates by magnetron sputtering. Detailed investigation about the deposition condition revealed that crystalline phase begins to form at about 300℃, which roughly correspond to half the melting temperature of the material where surface migration of deposited atom starts to take place. Substrate bias effect was also investigated, which showed the degradation of crystallinity for the substrate temperature of 350℃ while improvement of crystallinity was found for 300℃ samples.
机译:磁控溅射已成功在SiO_2衬底上沉积了Si_(1-x)Ge_x(x〜0.8)微晶。对沉积条件的详细研究表明,结晶相大约在300℃时开始形成,这大约相当于沉积原子开始发生表面迁移的材料的熔化温度的一半。还研究了基板的偏斜效应,结果表明在350℃的基板温度下结晶度降低,而在300℃的样品中结晶度有所提高。

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