首页> 外国专利> Magnetic arrangement for a sputter deposition source, and a magnetron sputter deposition source, and a method for depositing a film on a substrate with a magnetron sputter deposition source

Magnetic arrangement for a sputter deposition source, and a magnetron sputter deposition source, and a method for depositing a film on a substrate with a magnetron sputter deposition source

机译:用于溅射沉积源的磁性装置,磁控溅射沉积源以及利用磁控溅射沉积源在基板上沉积膜的方法

摘要

According to one aspect of the present disclosure, a magnetic arrangement 100 for a sputter deposition source is provided. The magnet arrangement comprises a first magnet (110) and a second magnet (120) adapted to confine the plasma within the plasma confinement zone (150); And at least one magnetic field affecting element (115) comprising a magnetizable material, wherein the magnetizable material is adapted to cause local displacement of the plasma confinement zone towards at least one magnetic field affecting element. According to a second aspect, a method is provided for depositing a film on a substrate with a magnetron sputter deposition source (400) having a magnetic arrangement and a magnetron sputter deposition source comprising a magnet arrangement.
机译:根据本公开的一个方面,提供了一种用于溅射沉积源的磁性装置100。磁体装置包括第一磁体(110)和第二磁体(120),第一磁体(110)和第二磁体(120)适于将等离子体限制在等离子体限制区(150)内。以及至少一个包括可磁化材料的磁场影响元件(115),其中,所述可磁化材料适于使所述等离子体约束区域朝着至少一个磁场影响元件局部移位。根据第二方面,提供了一种用于利用具有磁布置的磁控溅射沉积源(400)和包括磁体布置的磁控溅射沉积源在基板上沉积膜的方法。

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