首页>
外国专利>
Magnetic arrangement for a sputter deposition source, and a magnetron sputter deposition source, and a method for depositing a film on a substrate with a magnetron sputter deposition source
Magnetic arrangement for a sputter deposition source, and a magnetron sputter deposition source, and a method for depositing a film on a substrate with a magnetron sputter deposition source
展开▼
机译:用于溅射沉积源的磁性装置,磁控溅射沉积源以及利用磁控溅射沉积源在基板上沉积膜的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
According to one aspect of the present disclosure, a magnetic arrangement 100 for a sputter deposition source is provided. The magnet arrangement comprises a first magnet (110) and a second magnet (120) adapted to confine the plasma within the plasma confinement zone (150); And at least one magnetic field affecting element (115) comprising a magnetizable material, wherein the magnetizable material is adapted to cause local displacement of the plasma confinement zone towards at least one magnetic field affecting element. According to a second aspect, a method is provided for depositing a film on a substrate with a magnetron sputter deposition source (400) having a magnetic arrangement and a magnetron sputter deposition source comprising a magnet arrangement.
展开▼