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首页> 外文期刊>Journal of Semiconductors >A novel sub 20 nm single gate tunnel field effect transistor with intrinsic channel for ultra low power applications
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A novel sub 20 nm single gate tunnel field effect transistor with intrinsic channel for ultra low power applications

机译:具有本征通道的新型亚20 nm单栅隧道场效应晶体管,用于超低功耗应用

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摘要

We propose a nanoscale single gate ultra thin body intrinsic channel tunnel field effect transistor using the charge plasma concept for ultra low power applications. The characteristics of TFETs (having low leakage) are improved by junctionless TFETs through blending advantages of Junctionless FETs (with high on current). We further improved the characteristics, simultaneously simplifying the structure at a very low power rating using an InAs channel. We found that the proposed device structure has reduced short channel effects and parasitics and provides high speed operation even at a very low supply voltage with low leakage. Simulations resulted in I_(OFF) of ~ 9 × 10~(-16)A/μm, I_(ON) of ~20 μA/μm, I_(ON)/I_(OFF) of ~2 × 10~(10), threshold voltage of 0.057 V, subthreshold slope of 7 mV/dec and DIBL of 86 mV/V for PolyGate/HfO_2/InAs TFET at a temperature of 300 K, gate length of 20 nm, oxide thickness of 2 nm, film thickness of 10 nm, low-k spacer thickness of 10 nm and V_(DD) of 0.2 V.
机译:我们针对超低功耗应用提出了一种利用电荷等离子体概念的纳米级单栅极超薄本征沟道隧道场效应晶体管。无结型TFET通过融合无结FET(高导通电流)的优点,改善了TFET的特性(具有低泄漏)。我们进一步改善了特性,同时使用InAs通道以非常低的额定功率简化了结构。我们发现,所提出的器件结构具有减小的短沟道效应和寄生效应,并且即使在非常低的电源电压和低泄漏情况下也能提供高速运行。仿真得出I_(OFF)为〜9×10〜(-16)A /μm,I_(ON)为〜20μA/μm,I_(ON)/ I_(OFF)为〜2×10〜(10) ,在300 K的温度下,PolyGate / HfO_2 / InAs TFET的阈值电压为0.057 V,亚阈值斜率为7 mV / dec,DIBL为86 mV / V,栅极长度为20 nm,氧化物厚度为2 nm,膜厚为10 nm,低k隔离层厚度为10 nm,V_(DD)为0.2 V.

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