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首页> 外文期刊>Journal of Nanoelectronics and Optoelectronics >Impact of Gate Engineering on Gate Leakage Behavior of Nano Scale MOSFETs with High-k Dielectrics
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Impact of Gate Engineering on Gate Leakage Behavior of Nano Scale MOSFETs with High-k Dielectrics

机译:栅极工程对具有高k电介质的纳米级MOSFET栅极泄漏行为的影响

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This paper discusses the gate leakage current characteristics based on gate tunnel model for different device structure having high-k dielectric as a gate dielectric and/or a spacer. In this study, a device structures are characterized to reduce the gate leakage current based on gate dielectric and the spacer structures. Several structures were also studied for other electrical performance parameters like on current, off current, drain induced barrier lowering (DIBL), subthreshhold slope(SS). The device structure in which the high-k dielectric extends to the bottom of the oxide spacers showed the smallest gate leakage current while the device structure in which gate dielectric is of high-k material and spacer is of silicon dioxide showed the best DIBL, SS, on current and off current characteristics.
机译:本文基于栅极隧道模型,针对具有高k电介质作为栅极电介质和/或隔离层的不同器件结构,讨论了栅极漏电流特性。在这项研究中,器件结构的特征是基于栅极电介质和隔离层结构来降低栅极泄漏电流。还研究了几种结构的其他电气性能参数,例如导通电流,截止电流,漏极引起的势垒降低(DIBL),下阈值斜率(SS)。高k电介质延伸到氧化物隔离层底部的器件结构显示出最小的栅极漏电流,而栅极电介质为高k材料且隔离层为二氧化硅的器件结构显示出最好的DIBL,SS ,导通和截止电流特性。

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