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首页> 外文期刊>Journal of Electronic Materials >Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates
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Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates

机译:使用原位刻蚀多孔模板降低HVPE生长的GaN外延层中的位错密度

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摘要

In this paper, a method was demonstrated to reduce the dislocation density of GaN film grown by hydride vapor phase epitaxy (HVPE) on an in situ selective hydrogen-etched GaN/sapphire template. The dislocations regions were etched by hydrogen to form cavities. The porous structure was formed on the GaN template grown by metal organic chemical vapor deposition after in situ hydrogen etching. The etching condition was optimized by modulating the etching temperature, pressure, and etching time. Two-step buffer layer growth and high temperature GaN film deposition were carried on the porous template. The growth parameters were optimized to keep the porous structure unfilled. The dislocations originally located in etched cavities could not propagate to the next layer grown by HVPE. Therefore, the dislocation density could be significantly reduced. High crystal quality of GaN is obtained with a low dislocation density. The full width at half-maximum FWHM of (002) is 35 arcs, and the FWHM of (102) is 48 arcs.
机译:在本文中,一种方法被证明可以降低通过氢化物气相外延(HVPE)在原位选择性氢蚀刻GaN /蓝宝石模板上生长的GaN薄膜的位错密度。氢蚀刻位错区域以形成空腔。在通过原位氢蚀刻之后通过金属有机化学气相沉积生长的GaN模板上形成多孔结构。通过调节蚀刻温度,压力和蚀刻时间来优化蚀刻条件。在多孔模板上进行两步缓冲层生长和高温GaN膜沉积。优化了生长参数以保持多孔结构未被填充。最初位于蚀刻腔中的位错无法传播到HVPE生长的下一层。因此,位错密度可以显着降低。 GaN的晶体质量高,位错密度低。 (002)的半最大FWHM的全宽为35弧度,而(102)的FWHM为48弧度。

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