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首页> 外文期刊>Journal of active and passive electronic devices >Impact of Design Parameters on 6T and 8T SRAM cells at 45nm technology
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Impact of Design Parameters on 6T and 8T SRAM cells at 45nm technology

机译:设计参数对45nm技术下的6T和8T SRAM单元的影响

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摘要

A SRAM cell is designed to meet the requirements for operation in nano ranges. SRAM is highly used circuits in memory chips as it is used in caches, FIFO, register files etc. The scaling of CMOS technology can cause a significant effect on SRAM cell such as leakage current, leakage power and delay etc. In this paper we propose a novel design of Static Random Access Memory for 8T SRAM cell for high speed operations, and we use two voltage sources connected to Bit line and Bit bar line for write and read operation. Simulation results confirmed that proposed 8T SRAM cell has improved parameters for write operation of leakage current is 69pA, leakage power is 7.581 nW and delay is 20.55ns and for read operation of leakage current is 53.90pA, leakage power is 1.709μW and delay is 21.44ns as compared to 6T SRAM in 45 nm technology.
机译:SRAM单元旨在满足纳米范围内的操作要求。 SRAM是高速缓存,FIFO,寄存器文件等中的存储器芯片中使用率很高的电路。CMOS技术的扩展可对SRAM单元造成重大影响,例如泄漏电流,泄漏功率和延迟等。在本文中,我们提出用于高速操作的8T SRAM单元的静态随机存取存储器的一种新颖设计,我们使用连接到位线和位条线的两个电压源进行写和读操作。仿真结果证实,提出的8T SRAM单元具有改进的参数,其漏电流的写操作为69pA,漏电流为7.581 nW,延迟为20.55ns,读操作的漏电流为53.90pA,漏电流为1.709μW,延迟为21.44 ns与45 nm技术中的6T SRAM相比。

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