In-situ X-ray diffraction investigations of thin films: Determination of thermoelastic constants

摘要

Recipes for in-situ, non-ambient X-ray diffraction stress measurements of thin films have been given in this paper. To this end detailed in-situ X-ray diffraction analyses of stress in Cu and Ni thin films have been performed in the temperature interval between -100℃ and 250℃. Apart from focusing on an accurate determination of the coefficients of thermal expansion of film and/or substrate and in-situ calibration of the specimen tempera-ture, attention is paid in particular to the use of measurements below ambient temperature. Thereby the thermoelastic behaviour in the absence of thermally activated processes (i.e. grain growth and defect annihilation) can be studied. This last possibility has rarely been exploited until now.