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首页> 外文期刊>Chemistry of Materials: A Publication of the American Chemistry Society >Rapid SiO2 Atomic Layer Deposition Using Tris(tert-pentoxy)silanol
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Rapid SiO2 Atomic Layer Deposition Using Tris(tert-pentoxy)silanol

机译:用三(叔戊氧基)硅烷醇快速沉积SiO2原子层

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摘要

Rapid SiO2 atomic layer deposition (ALD) can deposit very thick and conformal SiO2 films by silanol exposure to surfaces covered with Al catalysts. In this study, we have explored the growth of rapid SiO2 ALD films using liquid tris(tert-pentoxy)silanol (TPS). The SiO2 film thicknesses were determined using quartz crystal microbalance and X-ray reflectivity measurements. The SiO2 film thicknesses deposited during one silanol exposure were dependent on the substrate temperature, silanol pressure, and silanol exposure time. The dependence of the SiO2 growth on these parameters helped to establish the mechanism of rapid SiO2 ALD. For TPS exposures of 1 s, the SiO2 ALD growth rate was larger at lower temperatures and higher TPS pressures. SiO2 ALD thicknesses of 125-140 A were observed at the highest TPS pressures of ~1 Torr at lower temperatures of 150 and 175 °C. Rapid SiO2 ALD is believed to result from the growth of siloxane polymer chains at the Al-catalytic sites and the cross-linking of these polymer chains to form a dense SiO2 film. The results indicated that higher TPS fluxes increase the siloxane polymerization rates. Likewise, the lower temperatures reduce the cross-linking rates between the siloxane polymers that self-limit the SiO2 deposition. To explore the rate of cross-linking between the siloxane polymers, experiments were conducted where small TPS micropulses were employed with different delay times between the micropulses. The SiO2 ALD thicknesses decreased with increasing delay times. This behavior suggested that the longer delay times produced more cross-linking that self-limits the SiO2 deposition. Other experiments showed that higher temperatures produced faster nucleation of the rapid SiO2 ALD. The nucleation was nearly immediate at the higher temperatures and could be as long as 10 s at the lower temperatures. The growth kinetics of rapid SiO2 ALD can be understood in terms of the temperature dependence of nucleation and cross-linking and the pressure dependence of the siloxane polymerization rate. Rapid SiO2 ALD was also dependent on the presence of pyridine derivatives in the TPS. These Lewis base impurities catalyze both the initial nucleation and the cross-linking reaction during rapid SiO2 ALD.
机译:快速的SiO2原子层沉积(ALD)可通过将硅烷醇暴露于Al催化剂覆盖的表面来沉积非常厚的保形SiO2膜。在这项研究中,我们探索了使用液体三(叔戊氧基)硅烷醇(TPS)生长快速SiO2 ALD膜的方法。使用石英晶体微量天平和X射线反射率测量来确定SiO 2膜的厚度。在一次硅烷醇暴露期间沉积的SiO2膜厚度取决于基材温度,硅烷醇压力和硅烷醇暴露时间。 SiO 2生长对这些参数的依赖性有助于建立快速SiO 2 ALD的机理。对于1秒钟的TPS暴露,在较低的温度和较高的TPS压力下,SiO2 ALD的生长速率较大。在150和175°C的较低温度下,在〜1 Torr的最高TPS压力下观察到SiO2 ALD厚度为125-140A。据信,快速的SiO2 ALD是由于硅氧烷聚合物链在Al催化位点处的生长以及这些聚合物链的交联形成致密的SiO2膜而产生的。结果表明,较高的TPS通量可提高硅氧烷的聚合速率。同样,较低的温度会降低硅氧烷聚合物之间的自交速率,从而限制了SiO2的沉积。为了探索硅氧烷聚合物之间的交联速率,进行了实验,其中使用了小的TPS微脉冲,每个微脉冲之间的延迟时间不同。 SiO2 ALD厚度随延迟时间的增加而减小。此行为表明,较长的延迟时间会产生更多的交联,从而自发限制SiO2的沉积。其他实验表明,较高的温度可使快速SiO2 ALD更快地成核。在较高温度下成核几乎是立即的,而在较低温度下可长达10 s。可以根据成核和交联的温度依赖性以及硅氧烷聚合速率的压力依赖性来理解快速SiO2 ALD的生长动力学。快速SiO2 ALD也取决于TPS中吡啶衍生物的存在。这些路易斯碱杂质催化快速SiO2 ALD期间的初始成核和交联反应。

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