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Lead-free soldering and its problems

机译:无铅焊接及其问题

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Progress in electronics technology, that in information technology in particular, has accelerated use of lead containing solder. Micro soldering using Sn-Pb system alloy is now supporting manufacture of advanced electronic products, including mobile telephones, PDAs, home electric appliances, car electronic products and portable audio-visual hand sets. Without Sn-Pb solder, present electronics industry cannot be maintained. However, use of lead Pb-Sn solder is not possible for the future, and application of lead-free solder to eliminate use of lead is a must for world electric and electronic machine manufacturer to prevent possible adverse effects caused by lead.
机译:电子技术的进步,特别是信息技术的进步,加速了含铅焊料的使用。现在,使用Sn-Pb系合金的微焊接技术正在支持先进电子产品的生产,包括移动电话,PDA,家用电器,汽车电子产品和便携式视听手机。没有Sn-Pb焊料,就无法维持目前的电子工业。但是,将来不可能使用铅Pb-Sn焊料,而应用无铅焊料来消除铅的使用对于世界电气和电子机械制造商来说是必须的,以防止铅引起的不利影响。

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