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Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

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1.Intermetallic growth behaviour of gold ball bonds encapsulated with green moulding compounds

机译：绿色成型化合物封装的金球键的金属间生长行为
- 作者：Sutiono S.;Seah A.;Chew S.;Calpito D.;Saraswati;Stephan D.;Wulff F.;Breach C.D.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- corrosion;
- encapsulation;
- gold;
- lead alloys;
- lead bonding;
- moulding;
- silver alloys;
- tin alloys;
- Au;
- Pb-Sn;
- Sn-Ag;
- ball lifts;
- encapsulated devices;
- gold ball bonding wires;
- gold ball bonds;
- green compound;
- green moulding compounds;
- high temperature storage;
- intermetallic;
2.Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test

机译：在跌落测试和热循环测试中，未填充的底部填充剂对区域阵列封装的板级焊点可靠性的影响研究
- 作者：Ibe E.S.;Loh K.I.;Jing-en Luan;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
3.Investigating the cyclic bending of PCB subassembly during board level drop test

机译：研究板级跌落测试期间PCB组件的周期性弯曲
- 作者：Eric Pek;Chwee Teck Lim;Tong Yan Tee;Jing-en Luan;Tan;V.B.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
4.Investigation of IMC layer effect on PBGA solder joint thermal fatigue reliability

机译：IMC层对PBGA焊点热疲劳可靠性影响的研究
- 作者：Fa-Xing Che;Pang J.H.L.;Lu-Hua Xu
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper alloys;
- finite element analysis;
- nickel compounds;
- reliability;
- silver alloys;
- solders;
- thermal stress cracking;
- tin alloys;
- CuNiSn;
- IMC layer;
- Ni-Au;
- PBGA component;
- PBGA solder joint;
- PCB boards;
- SnAgCu;
- Weibull model;
- elastic modulus;
- electronic assembly reliab;
5.Low temperature fluxless technology for ultra-fine pitch and large devices flip-chip bonding

机译：低温无助焊剂技术，用于超细间距和大型器件的倒装芯片焊接
- 作者：Davoine C.;Fendler M.;Marion F.;Louis C.;Destefanis G.;Fortunier R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
6.LTCC based integration for RF applications

机译：基于LTCC的RF应用集成
- 作者：Wai;L.L.;Lu;A.C.W.;Wei Fan;Chua;K.M.;Sunappan;V.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
7.Manufacture of two-dimensional monomode optical fiber array using MEMS technology

机译：利用MEMS技术制造二维单模光纤阵列
- 作者：Weiland D.;Missoffe A.C.M.;Luetzelschwab M.;Desmulliez M.P.Y.;Beck C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
8.Measurement of electrical parameters of silicon up to 60GHz

机译：测量高达60GHz的硅的电参数
- 作者：Salhi;F.;Riedl;W.;John;W.;Reichl;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
9.Mechanism of underfill voids formation in flip chip packaging

机译：倒装芯片封装中底部填充空隙形成的机理
- 作者：Goh E.;Zhao X.L.;Anand A.;Mui Y.C.;Parthasarathy S.;Master R.N.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- flip-chip devices;
- solders;
- voids (solid);
- OLGA;
- flip chip packaging;
- flux residue;
- organic land grid array;
- solder bump;
- solder mask;
- underfill flip chip packages;
- underfill voids formation;
10.Minimizing reflections and cross-talk in chip packages

机译：最小化芯片封装中的反射和串扰
- 作者：Ndip;I.;John;W.;Reichl;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
11.Modeling energy transfer to copper wire for bonding in an inert environment

机译：模拟能量转移到铜线以在惰性环境中进行键合
- 作者：Hong Meng Ho;Tan;J.;Yee Chen Tan;Boon Hoe Toh;Xavier;P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
12.Modeling the performance of flexible substrates for lead-free applications

机译：为无铅应用建模柔性基板的性能
- 作者：Yin;C.Y.;Lu;H.;Bailey;C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
13.Multi-level numerical analysis on the reliability of Cu/low-k interconnection in FCBGA package

机译：FCBGA封装中Cu / low-k互连可靠性的多层次数值分析
- 作者：Fiori;V.;Xueren Zhang;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
14.Multistack flip chip 3D packaging with copper plated through-silicon vertical interconnection

机译：多层镀覆倒装3D封装，具有镀铜的直通硅垂直互连
- 作者：Hon R.;Lee S.W.R.;Zhang S.X.;Wong C.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
15.Nanoindentation on SnAgCu lead-free solder and analysis

机译：SnAgCu无铅焊料的纳米压痕及其分析
- 作者：Luhua Xu;Pang;J.H.L.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- Young's modulus;
- copper alloys;
- hardness testing;
- indentation;
- silver alloys;
- solders;
- tin alloys;
- CSM technique;
- SAC387 solder alloy;
- SnAgCu;
- creep effect;
- lead-free solder;
- nanoindentation;
- solder joints;
- test optimization;
16.Next generation low stress plastic cavity package for sensor applications

机译：适用于传感器应用的下一代低应力塑料腔体封装
- 作者：Zimmerman;M.;Felton;L.;Lacsamana;E.;Navarro;R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
17.Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses

机译：结合吸湿和热机械应力的电子封装非线性有限元分析
- 作者：Samson Yoon;Bongtae Han;Seungmin Cho;Chang-Soo Jang
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
18.Novel wafer level package technology studies for image sensor devices

机译：用于图像传感器设备的新型晶圆级封装技术研究
- 作者：Viswanadam;G.;Bieck;F.;Suthiwongsunthor;N.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
19.Numerical analysis by 3D finite element wire bond simulation on Cu/low-k structures

机译：Cu / low-k结构的3D有限元引线键合仿真数值分析
- 作者：Viswanath;A.G.K.;Wang Fang;Xiaowu Zhang;Ganesh;V.P.;Lim;L.A.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
20.Optimal design in enhancing board-level thermomechanical and drop reliability of package-on-package stacking assembly

机译：优化设计以提高板级热机械性能并降低堆叠封装堆叠组件的可靠性
- 作者：Yi-Shao Lai;Tong Hong Wang;Ching-Chun Wang;Chang-Lin Yeh
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
21.PEDL (polymer encapsulated dicing line) technology for copper/low-k dielectrics interconnect

机译：用于铜/低k电介质互连的PEDL（聚合物封装切割线）技术
- 作者：Seung Wook Yoon;Wirtasa D.;Lim S.;Ganesh V.;Viswanath A.;Kripesh V.;Iyer M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- assembling;
- ball grid arrays;
- copper;
- dielectric materials;
- encapsulation;
- fine-pitch technology;
- flip-chip devices;
- integrated circuit interconnections;
- integrated circuit packaging;
- plastic packaging;
- polymers;
- 150 micron;
- 35 mm;
- Cu;
- MSL test;
- PEDL technology;
- copper/;
22.Post-curing influence on electrostatic charges deposited on epoxy/silica composites used for microelectronic packaging

机译：后固化对用于微电子包装的环氧树脂/二氧化硅复合材料上沉积的静电荷的影响
- 作者：Sylvestre A.;Ouajji H.;Gonon P.;Teysseyre J.;Jomni F.;Raouadi K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- composite materials;
- corona;
- curing;
- electrostatics;
- integrated circuit packaging;
- polymers;
- silicon compounds;
- surface potential;
- 30 C;
- 50 C;
- 70 C;
- SiO/sub 2/;
- corona discharge;
- electrostatic charges;
- epoxy resins;
- epoxy/silica composites;
- microelectronic packaging;
- neg;
23.Power integrity/signal integrity co-simulation for fast design closure

机译：电源完整性/信号完整性协同仿真，可快速完成设计
- 作者：Srinivasan;K.;Mandrekar;R.;Engin;E.;Swaminathan;M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
24.Prediction of board-level reliability of chip-scale packages under consecutive drops

机译：连续下降下芯片级封装的板级可靠性预测
- 作者：Chang-Lin Yeh;Yi-Shao Lai;Chin-Li Kao
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
25.Predictive solder joint reliability assessment of board-on-chip package for DDR-II DRAM application

机译：DDR-II DRAM应用的片上板封装的可预测焊点可靠性评估
- 作者：Seungmin Cho;Changsoo Jang;Seongyoung Han;Jamil Ahmad;Sitaraman;S.K.;Yeongkook Kim;Hojeong Moon
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- DRAM chips;
- chip-on-board packaging;
- finite element analysis;
- interferometry;
- life testing;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- 3D finite element model;
- BOC package;
- DDR-II DRAM;
- SnAgCu;
- SnPb;
- ball pad design;
- board-on-chip package;
- fatigue life;
- moire inter;
26.Process characteristics of 100 /spl mu/m bump pitch with lead-free and high lead plating solder bump

机译：无铅高铅镀锡焊料凸点的工艺特性为100 / splμ/ m
- 作者：Yu R.;Jui-I Yu;Tai T.;Kang C.H.;Jami Chen;Taguibao J.;Mars Tsai;Homing Tong;Ker-Chang Hsieh
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
27.Process technique for singulating fragile devices

机译：分离易碎设备的工艺技术
- 作者：Agarwal A.;Mohanraj S.;Premachandran C.S.;Singh J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
28.Prototype development for chip-chip interconnection by multimode waveguide

机译：通过多模波导进行芯片-芯片互连的原型开发
- 作者：Pong B.L.S.;Pamidigantham R.;Premachandran C.S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
29.Qualification of phase change thermal interface material for wave solder heat sink on FCBGA package

机译：FCBGA封装中波峰焊散热器相变热界面材料的鉴定
- 作者：Bharatham L.;Wong Shaw Fong;Torresola J.;Chen Chee Koang
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
30.Quantitative reliability analysis of electronic packages in consideration of variability of model parameters

机译：考虑模型参数变异性的电子包装定量可靠性分析
- 作者：Wen-Fang Wu;Yu-Yu Lin;Hong-Tsu Young
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
31.Radiation from arbitrary shape power/ground plane pair structure

机译：任意形状的电源/地平面对结构的辐射
- 作者：Rui Yang;Rotaru M.D.;Kuruveettil H.;Pinjala D.;Iyer M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
32.Reducing the effect of mechanical stress on low-k die - case study

机译：降低机械应力对低k裸片的影响-案例研究
- 作者：Sweeney F.;Kim J.;Morison T.;Bai C.;Reyes E.;Chung-yi Lin
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
33.Reliability and thermal structure design for CMOS image sensor

机译：CMOS图像传感器的可靠性和热结构设计
- 作者：Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Chia Hsu;Shen-Li Fu;Chung-Chi Yang;Kuan-Chieh Huang
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
34.Reliability of Cu/low-k wafer level package (WLP)

机译：铜/低k晶圆级封装（WLP）的可靠性
- 作者：Seung Wook Yoon;Wirtasa D.;Lim S.;Jong Ming Ching;Kripesh V.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper;
- dielectric materials;
- electroplating;
- interconnections;
- lead bonding;
- printed circuits;
- reliability;
- silicon compounds;
- solders;
- 0.13 micron;
- 300 mm;
- Cu;
- Cu metal redistribution;
- ILD stack reliability;
- PCB board;
- SiO/sub 2/;
- area-array packaging;
- black diamond;
- el;
35.Response spectra analysis for transient structural responses of board-level electronic packages subjected to half-sine impact acceleration pulses

机译：半正弦冲击加速度脉冲作用下的板级电子封装瞬态结构响应的响应谱分析
- 作者：Chang-Lin Yeh;Tsung-Yueh Tsai;Yi-Shao Lai
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
36.Self assembly of microcomponents on patterned substrate using capillary force

机译：使用毛细作用力将微组件自组装在带图案的基材上
- 作者：Balakrishnan;S.;Kripesh;V.;Teo Poi Siong;Iyer;M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- X-ray diffraction;
- gold;
- microassembling;
- monolayers;
- self-assembly;
- silicon;
- sputter deposition;
- substrates;
- Au;
- Si;
- X-ray diffraction;
- capillary force;
- free energy minimization;
- gold deposition technique;
- gold pattern arrays;
- hydrophobic SAM;
- hydrophobic lubricant sit;
37.Silver glues and lead-free alloys in die attach of power devices

机译：功率器件的芯片连接中的银胶和无铅合金
- 作者：Gobbato;L.;Scandurra;A.;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- adhesives;
- electronics packaging;
- microassembling;
- polymers;
- power electronics;
- die attach;
- die bonding;
- electronic products;
- glue material;
- lead free solders;
- lead-free alloys;
- power devices;
- power packages;
- silver glues;
- soft solders;
38.Simulation methodologies for electromagnetic compatibility (EMC) and signal integrity (SI) for system design

机译：系统设计的电磁兼容性（EMC）和信号完整性（SI）的仿真方法
- 作者：Christopoulos C.;Thomas D.W.P.;Sewell P.;Paul J.;Biwojno K.;Wykes J.;Tang Q.;Greedy S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
39.Simulation-based design optimization of solder joint reliability of wafer level copper column interconnects

机译：晶圆级铜柱互连焊点可靠性的基于仿真的设计优化
- 作者：Wei Sun;Tay A.A.O.;Vedantam S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
40.Solder joint integrity of various surface finished build-up flip chip packages by 4-point monotonic bending test

机译：通过四点单调弯曲测试，对各种表面完成的积层倒装芯片封装的焊点完整性
- 作者：Nakamura T.;Miyamoto Y.;Hosoi Y.;Newman K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- bending;
- copper alloys;
- failure analysis;
- flip-chip devices;
- lead alloys;
- mechanical testing;
- silver alloys;
- solders;
- surface finishing;
- tin alloys;
- Cu-doped solder;
- EDX;
- OSP pad surface;
- Pb-free solder;
- SEM;
- SnAgCu;
- SnPbCu;
- ball grid array;
- electroless n;
41.Spherical boron nitride fillers for high performance thermal greases

机译：球形氮化硼填料，用于高性能导热油脂
- 作者：Gowda A.;Paisner S.N.;Tonapi S.;Meneghetti P.;Hans P.;Strosaker G.;Acharya A.;Nagarkar K.;Srihari K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
42.Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate

机译：应力对锡-银-铜-无铅焊料与铜基板之间界面上IMC生长的影响
- 作者：Ngoh S.L.;Thou W.;Pang H.L.;Spowage A.C.;Li J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper alloys;
- electroplating;
- nickel alloys;
- palladium alloys;
- silver alloys;
- solders;
- stress analysis;
- surface finishing;
- tin alloys;
- C-ring technique;
- Cu substrate;
- IMC growth;
- Ni-Pd;
- Sn-Ag-Cu;
- electroless plating;
- immersion Au;
- immersion Sn;
- intermetallic growth;
- lead;
43.Study of PCB strains and component position under board level drop test

机译：在板级跌落测试下研究PCB应变和元件位置
- 作者：Fong Kuan Ng;Chwee Teck Lim;Pek;E.;Jing-En Luan;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
44.Temperature reduced direct bonding by plasma assisted wafer surface pre-treatment

机译：通过等离子体辅助晶片表面预处理降低温度，降低直接键合
- 作者：Pelzer;R.;Dragoi;V.;Lee;D.;Kettner;P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
45.The analysis of the bending and twisting moments induced sweep deflection for semiconductor package applications

机译：弯曲和扭曲力矩引起的半导体封装扫掠偏转的分析
- 作者：Huang-Kuang Kung
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- bending;
- lead bonding;
- semiconductor device packaging;
- bending moments;
- semiconductor package;
- sweep deflection;
- sweep deformation;
- twisting moments;
- wire bond geometry;
46.The more accurate method to extract dielectric constant and loss tangent of insulated material on microwave frequencies

机译：在微波频率上提取绝缘材料的介电常数和损耗角正切的更准确方法
- 作者：Chia-Hsing Chou;Pao-Nan Li;Sung-Mao Wu
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
47.Thermal analysis and experimental validation on TFT-LCD panels for image quality concerns

机译：TFT-LCD面板的热分析和实验验证，以解决图像质量问题
- 作者：Chung-Yi Chu;Min-Chun Pan;Ho J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
48.Thermal and mechanical behaviors of underfills for flip-chip packaging

机译：倒装芯片封装底部填充材料的热和机械性能
- 作者：Huang Shuang Wu;Chia Yong Poo;Low Siu Waf;Wong Mee Mee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
49.Thermal modelling of multiple die packages

机译：多芯片封装的热建模
- 作者：Szabo P.;Renez M.;Szekely V.;Poppe A.;Farkas G.;Courtois B.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
50.Thermomechanical design for reliability of WLPs with compliant interconnects

机译：热机械设计可确保具有兼容互连的WLP的可靠性
- 作者：Dudek;R.;Walter;H.;Doering;R.;Michel;B.;Meyer;T.;Zapf;J.;Hedler;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
51.Through wafer copper via for silicon based SiP application

机译：硅基SiP应用的晶圆通孔
- 作者：Witarsa;D.;Soundarapandian;M.;Seung Wook Yoon;Kripesh;V.;Teoh Kum Weng;Nagarajan;R.;Khan;O.K.N.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper;
- elemental semiconductors;
- flip-chip devices;
- integrated circuit interconnections;
- lead bonding;
- lithography;
- silicon;
- solders;
- sputter etching;
- system-in-package;
- 200 micron;
- 300 micron;
- 3D stacked modules;
- 8 inch;
- Cu;
- DRIE etching;
- Si;
- carrier wafer fabrication;
52.Through-wafer interconnection by deep damascene process for MEMS and 3D wafer level packaging

机译：通过深镶嵌工艺实现晶圆间互连，用于MEMS和3D晶圆级封装
- 作者：Ranganathan;N.;Jiang Ning;Liao Ebin;Premachandran;C.S.;Prasad;K.;Balasubramanian;N.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
53.TIM characterization for high performance microprocessors

机译：高性能微处理器的TIM特性
- 作者：Liu Bao Min;Mui Y.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
54.Ultra small form factor plastic package transceiver modules for large core fiber systems

机译：适用于大芯光纤系统的超小型塑料封装收发器模块
- 作者：Ho;F.;Lui;B.;Wai Hung;Fu-Wa Tong;Choi;T.;Shu-Kin Yau;Chow;A.;Wong;E.;Ng;S.;Egnisaban;G.;Mangenete;T.;Sing Cheng;Wipiejewski;T.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
55.Ultrathin assemblies on flexible substrates

机译：柔性基板上的超薄组件
- 作者：Pahl B.;Kallmayer C.;Aschenbrenner R.;Reichl H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
56.Very thin packaging of capped MEMS accelerometer device

机译：带盖的MEMS加速度计设备的非常薄的包装
- 作者：Lacsamana;E.S.;Navarro;R.M.;Mena;M.G.;Felton;L.E.;Webster;W.A.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
57.Void of leaded and lead-free solder paste on different PCB surface pad finish under various reflow conditions - further investigation on void of SnInAgBi lead-free soldering paste

机译：在各种回流条件下，不同PCB表面焊盘上的有铅和无铅焊膏的空隙-进一步研究SnInAgBi无铅焊膏的空隙
- 作者：Xiaobai Wang
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
58.Wafer level processing on re-built wafer for chip stacking

机译：在重建晶片上进行晶片级处理以进行芯片堆叠
- 作者：Souriau;J.-C.;Lignier;O.;Val;C.;Charrier;M.;Poupon;G.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- DRAM chips;
- SRAM chips;
- chip scale packaging;
- flash memories;
- interconnections;
- resins;
- system-in-package;
- 3D expansion;
- 3D interconnection;
- 3D modules;
- 3D packaging;
- 3D-PLUS process;
- DRAM;
- SRAM;
- SiP;
- chip stacking;
- flash memory;
- mechanical consistency;
- re-built wafer;
- sys;
59.Wafer level thin film encapsulation for MEMS

机译：MEMS的晶圆级薄膜封装
- 作者：Gillot;C.;Pornin;J.L.;Arnaud;A.;Lagoutte;E.;Sillon;N.;Souriau;J.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
60.Indexes

机译：指标
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》
61.Covers

机译：盖子
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》
62.Title page

机译：封面
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》
63.Copyright page

机译：版权页
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》
64.Foreword

机译：前言
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》
65.Conference committee

机译：会议委员会
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》