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Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

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1.A compact and wideband rectangular dielectric resonator antenna

机译：紧凑型宽带矩形介质谐振器天线
- 作者：Chee-Parng Chua;Pavovich;P.A.;Mihai Dragos;R.;Mook-Seng Leong
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- broadband antennas;
- dielectric resonator antennas;
- compact antenna;
- dielectric resonator antenna;
- integrated antenna;
- wideband antenna;
2.A model for efficient and improved measurements of the complex permittivity of thin organic packaging materials using open-ended coaxial line technique

机译：使用开放式同轴线技术有效和改进地测量薄有机包装材料的复介电常数的模型
- 作者：Lim Ying Ying;Rotaru M.D.;Alphones A.;Popov A.P.;Rajoo R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
3.A novel approach of depositing embedded resistors

机译：沉积嵌入式电阻的新方法
- 作者：Tan Kwang Hong;Lee Teck Kheng
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- aerosols;
- carbon;
- coating techniques;
- dissociation;
- electric resistance;
- heat treatment;
- resistors;
- 125 C;
- 150 C;
- 48 hours;
- C;
- aerosol-based deposition;
- atomization process;
- carbon paste;
- dimensional control;
- embedded resistors;
- moisture exposure;
- resistance tolerance;
- sh;
4.A novel polishing mechanism used in manufacturing ultra-high uniformity gold solder bump

机译：用于制造超高均匀度金焊料凸块的新型抛光机制
- 作者：Jung-Tang Huang;Pen-Shan Chao;Hou-Jun Hsu;Sheng-Hsiung Shih
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
5.A study of ultrasonic bonding of minute Au bumps

机译：微小金凸块的超声键合研究
- 作者：Tsukiyama S.;Sugimoto T.;Ohno Y.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- aluminium;
- chromium;
- evaporation;
- focused ion beam technology;
- gold;
- nickel;
- scanning electron microscopy;
- shear strength;
- solders;
- titanium;
- ultrasonic bonding;
- 10 micron;
- 150 C;
- 50 kHz;
- 50 micron;
- Al;
- Au;
- Au bumps;
- Cr;
- Cr evaporation;
- Ni;
- Ti;
- Ti evaporation;
- bonding temperat;
6.Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow

机译：改进的虚拟裂纹闭合方法在无铅回流焊塑料IC封装脱层分析中的应用
- 作者：Hu Guojun;Tay A.A.O.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
7.Characterization and modeling of hygroscopic swelling and its impact on failures of a flip chip package with no-flow underfill

机译：吸湿膨胀的表征和建模及其对无流动底部填充的倒装芯片封装失效的影响
- 作者：Jiang Zhou;Tong Yan Tee;Xueren Zhang;Jing-en Luan
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
8.Comprehensive analysis of a larger die, copper pillar bump flip chip package with no-flow underfill

机译：全面分析具有无流动底部填充的更大裸片，铜柱凸点倒装芯片封装
- 作者：Xiaowu Zhang;Pinjala D.;Iyer M.K.;Chew G.;Zhaohui Ma;Teck Tiong Tan;Chew J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- adhesion;
- assembling;
- copper;
- cracks;
- flip-chip devices;
- reflow soldering;
- swelling;
- thermomechanical treatment;
- Cu;
- adhesion strengths;
- copper pillar bump;
- fillet cracking;
- flip chip assembly process;
- flip chip package;
- hygroswelling models;
- moisture preconditioning;
- n;
9.Dispensing solder paste micro-deposits to 0.2mm - a process solution

机译：分配焊膏微沉积至0.2mm-一种处理解决方案
- 作者：Vivari J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- adhesives;
- solders;
- 0.2 mm;
- solder paste deposits;
- solder paste dispensing;
- solder paste microdeposits;
10.Effect of solder voids on thermal performance of a high power electronic module

机译：焊锡空隙对大功率电子模块热性能的影响
- 作者：Biswal L.;Krishna A.;Sprunger D.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
11.Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications

机译：评估用于射频应用的无铅塑料封装的引线键合和倒装芯片互连
- 作者：Engl;M.;Pressel;K.;Theuss;H.;Dangelmaier;J.;Eurskens;W.;Knapp;H.;Simbuerger;W.;Weigel;R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
12.Experimental characterization of flow boiling heat dissipation in a microchannel heat sink with different orientations

机译：不同方向微通道散热器中流沸腾散热的实验表征
- 作者：Zhang H.Y.;Pinjala D.;Wong T.N.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- boiling;
- bubbles;
- cooling;
- flip-chip devices;
- heat sinks;
- microchannel flow;
- multiphase flow;
- thermal resistance;
- 0.2 mm;
- 15 mm;
- 2 mm;
- FC-72 flow boiling;
- contact resistance;
- flip chip BGA package;
- heat dissipation;
- heat sink outlet;
- horizontal flow;
- inl;
13.Experimental study of a radial micro-channel cooling plate

机译：径向微通道冷却板的实验研究
- 作者：Poppe A.;Horvath G.;Bognar G.;Kohari Z.;Desmulliez M.P.Y.;Rencz M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
14.High-G drop impact response and failure analysis of a chip packaged printed circuit board

机译：芯片封装印刷电路板的高G跌落冲击响应和故障分析
- 作者：Jenq S.T.;Sheu H.S.;Chang-Lin Yeh;Yi-Shao Lai;Jenq-Dah Wu
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
15.Influence of bump geometry, adhesives and pad finishings on the joint resistance of Au bump and A/NCA flip chip interconnection

机译：凸块的几何形状，粘合剂和焊盘涂饰剂对金凸块和A / NCA倒装芯片互连的接合电阻的影响
- 作者：Tan Ai Min;Sharon Pei-Siang Lim;Yeo A.;Lee C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
16.Parametric design and solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

机译：细间距铜柱式晶圆级封装（WLP）的参数设计和焊点可靠性分析
- 作者：Xiaowu Zhang;Kripesh;V.;Chai;T.C.;Teck Chun Tan;Pinjala;D.;Iyer;M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper;
- fatigue testing;
- fine-pitch technology;
- finite element analysis;
- mobile computing;
- reliability;
- solders;
- viscoplasticity;
- 0.4 mm;
- Cu;
- PCB CTE;
- PCB thickness;
- WLP;
- board level reliability enhancement;
- die thickness;
- fatigue life;
- fine pitch technology;
- mobile comp;
17.Passive two-phase cooling solution with a novel heat transfer enhancement technique for electronic packages

机译：采用新型传热增强技术的电子封装被动式两相冷却解决方案
- 作者：Khan N.;Pinjala D.;Toh K.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- boiling;
- cooling;
- elemental semiconductors;
- microchannel flow;
- micromachining;
- porous materials;
- silicon;
- thermal management (packaging);
- 0.5 mm;
- 40 mm;
- MMPC structure;
- Si;
- boiling heat transfer enhancement;
- critical heat flux;
- electronic packages;
- flu;
18.Polymer based optical interconnect module for a bidirectional transceiver and optical N/spl times/M star couplers for datacom applications with data rates > 1Gbps

机译：基于聚合物的双向互连收发器光互连模块和N / spl times / M星型光耦合器，适用于数据速率> 1Gbps的数据通信应用
- 作者：Frese I.;Schwab U.;Nahrstedt E.;Klotzbucher T.;Kunz St.;Teubner U.;Doll T.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
19.Quilt packaging: a new paradigm for interchip communication

机译：被子包装：芯片间通信的新范例
- 作者：Bernstein;G.H.;Qing Liu;Zhuowen Sun;Fay;P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
20.Solder joint fatigue in a surface-mount assembly subjected to mechanical loading

机译：机械安装的表面贴装组件中的焊点疲劳
- 作者：Tamin M.N.;Liew Y.B.;Wagiman A.N.R.;Loh W.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
21.Study on the packaging technology for a high-G MEMS accelerometer

机译：高G MEMS加速度计的封装技术研究
- 作者：Xia Lou;Jinjie Shi;Wei Zhang;Yufeng Jin
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
22.The reliability of isotropically conductive adhesive as solder replacement - a case study using LCP substrate

机译：各向同性导电胶替代焊料的可靠性-使用LCP基板的案例研究
- 作者：Kuusiluoma S.;Kiilunen J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
23.10 Gbps backplane design methodology with sensitivity analysis and statistical analysis

机译：具有灵敏度分析和统计分析的10 Gbps背板设计方法
- 作者：Jaemin Kim;Seungyong Baek;Hyunjeong Park;Sukho Kim;Youngsoo Hong;Dongsoon Lim;Joungho Kim
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
24.40Gb/s parallel optical interconnection module for optical backplane application

机译：用于光背板应用的40Gb / s并行光互连模块
- 作者：Suzuki;K.;Wakazono;Y.;Suzuki;A.;Suzuki;S.;Yamaguchi;T.;Kikuchi;K.;Nakagawa;H.;Ibaragi;O.;Aoyagi;M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
25.4-dimensional design analysis and optimization of system-in-package

机译：封装系统的4维设计分析和优化
- 作者：Tong Yan Tee;Hun Shen Ng;Jing-en Luan;Xueren Zhang;Kim Yong Goh;Grech;A.M.;Duca;R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
26.An improved low-cost 6.4 Gbps wafer-level tester

机译：改进的低成本6.4 Gbps晶圆级测试仪
- 作者：Majid A.M.;Keezer D.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
27.An integrated and compact ISM bandpass filter using combline structures

机译：使用梳状线结构的集成式紧凑型ISM带通滤波器
- 作者：Lim Ying Ying;Rotaru;M.D.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
28.Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

机译：化学镀Ni-P UBM /无铅焊点的装配成品率提高
- 作者：Yong-Min Kwon;Young-Doo Jeon;Kyung-Wook Paik;Jung-Do Kim;Jin-woo Lee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ageing;
- cooling;
- failure analysis;
- fatigue testing;
- flip-chip devices;
- metallisation;
- soldering;
- thermal stresses;
- NiP;
- SnAgCu;
- aging treatment;
- assembly yield enhancement;
- brittle failure;
- chip warpages;
- cooling processes effect;
- electroless solder joints;
- failure anal;
29.Assessment of vacuum lifetime in nL-packages

机译：评估nL包装中的真空寿命
- 作者：Reinert;W.;Kahler;D.;Longoni;G.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
30.Bed of nails: fine pitch wafer-level packaging interconnects for high performance nano devices

机译：钉子床：用于高性能纳米器件的细间距晶圆级封装互连
- 作者：Vempati Srinivasa Rao;Kripesh V.;Seung Wook Yoon;Witarsa D.;Tay A.A.O.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
31.Bend fatigue reliability test and analysis for Pb-free solder joint

机译：无铅焊点弯曲疲劳可靠性测试与分析
- 作者：Fa-Xing Che;Pang H.L.J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- assembling;
- bending;
- copper alloys;
- electronics packaging;
- fatigue testing;
- finite element analysis;
- gold;
- nickel;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- 125 C;
- 25 C;
- FEA model;
- Ni-Au;
- Sn-Ag-Cu;
- VQFN assembly;
- bend fatigue reliability test;
- finite element analysi;
32.Bondability and reliability for insulated wirebonding process with 63/spl mu/m pitch capability

机译：间距为63 / spl mu / m的绝缘导线焊接工艺的可焊性和可靠性
- 作者：Ibrahim;M.R.;Tiu Kong Bee;A.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
33.Bonding development for non-conductive paste (NCP)

机译：非导电胶（NCP）的粘合开发
- 作者：Lee T.K.;Lua E.;Low K.C.;Ng A.;Ng H.W.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
34.Bubbles formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on ACFs joints reliability

机译：使用各向异性导电膜（ACF）的刚柔基板中的气泡形成及其对ACF接头可靠性的影响
- 作者：Hyoung-Joon Kim;Soon-Min Hong;Se-Young Jang;Young-Joon Moon;Kyung-Wook Paik
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
35.Circuit model of elastomer probe for fine pitch wafer level package test applications

机译：用于细间距晶圆级封装测试应用的弹性体探针的电路模型
- 作者：Jayabalan;J.;Ooi;B.L.;Leong;M.S.;Iyer;M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
36.Coarsening processes in the lead-free solder alloy AgCu: theoretical and experimental investigations

机译：无铅焊料合金AgCu中的粗化工艺：理论和实验研究
- 作者：Muller W.H.;Bohme T.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
37.Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

机译：多铜柱互连的柔度，变形和热疲劳行为
- 作者：Liao;E.B.;Tay;A.A.O.;Ang;S.S.T.;Feng;H.H.;Nagarajan;R.;Kripesh;V.;Kumar;R.;Mahadevan;I.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
38.Considerations for minimizing radiation doses to components during X-ray inspection

机译：在X射线检查过程中最小化对部件的辐射剂量的注意事项
- 作者：Bernard D.;Blish R.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
39.Coprecursor approach to the fabrication of superhydrophobic durable self-cleaning films

机译：共前体方法制造超疏水耐用自洁膜
- 作者：Yonghao Xiu;Lingbo Zhu;Hess D.;Wong C.P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
40.Correlation between package-level ball impact test and board-level drop test

机译：封装级球撞击测试和板级跌落测试之间的相关性
- 作者：Chang-Lin Yeh;Yi-Shao Lai;Hsiao-Chuan Chang;Tsan-Hsien Chen
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- chip scale packaging;
- copper alloys;
- impact testing;
- production testing;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- SnAgCu;
- board level drop test;
- chip-scale package;
- package level ball impact test;
- solder joints;
41.Crosstalk analysis in frequency and time domain using FDTD-VF method

机译：使用FDTD-VF方法进行频域和时域的串扰分析
- 作者：Liu;Z.H.;See;K.Y.;Li;E.P.;Chua;E.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
42.Data-dependent jitter estimation using single pulse analysis method

机译：使用单脉冲分析方法的数据相关抖动估计
- 作者：Eakhwan Song;Junho Lee;Jingook Kim;Dong Gun Kam;Chunghyun Ryu;Joungho Kim
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
43.Design and development of stacked die technology solutions for memory packages

机译：设计和开发用于存储器封装的堆叠式芯片技术解决方案
- 作者：Chong;D.Y.R.;Liu;H.;Lim;B.K.;Win;P.;Wang;C.K.;Tan;H.B.;Sun;A.Y.S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
44.Design and evaluation of the 10-Gbps electrical transmission interface board for an optical backplane

机译：用于光背板的10 Gbps电传输接口板的设计和评估
- 作者：Suzuki;A.;Wakazono;Y.;Suzuki;K.;Kikuchi;K.;Nakagawa;H.;Suzuki;S.;Yamaguchi;T.;Ibaragi;O.;Aoyagi;M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
45.Design practices and issues for simultaneous switching noise

机译：同时切换噪声的设计规范和问题
- 作者：Takahashi N.;Sato K.;Honda Y.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
46.Development of ball grid array packages with improved thermal performance

机译：开发具有改善的热性能的球栅阵列封装
- 作者：Ma Y.Y.;Chong D.Y.R.;Wang C.K.;Sun A.Y.S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
47.Development of demonstrator kit for designing practical EMC compliant system

机译：开发用于设计符合EMC要求的实用系统的演示器套件
- 作者：Kye Yak See;Oswal;M.;Khan-ngern;W.;Canavero;F.;Christopoulos;C.;Grabinski;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
48.Development of fine pitch solders joint interconnection technology for flip chip assembly

机译：用于倒装芯片组装的细间距焊点互连技术的发展
- 作者：Zhou Wei;Chia Yong Poo;Low Siu Waf
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
49.Development of high performance photo-curable nanocomposites for electronics packaging

机译：开发用于电子包装的高性能光固化纳米复合材料
- 作者：Yangyang Sun;Zhuqing Zhang;Wong C.P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
50.Development of no-flow underfill materials and processes for Pb-free flip chip applications

机译：为无铅倒装芯片应用开发无流动底部填充材料和工艺
- 作者：Prabhakumar;A.;Buckley;D.;Gillespie;P.;Mandke;S.;Mills;R.;Rubinsztajn;S.;Susarla;P.;Tonapi;S.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
51.Die attach film application in multi die stack package

机译：芯片贴膜在多芯片堆叠封装中的应用
- 作者：Song S.N.;Tan H.H.;Ong P.L.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
52.Dielectric properties in thin film SrTiO/sub 3/ capacitor

机译：薄膜SrTiO / sub 3 /电容器的介电性能
- 作者：Ouajji H.;Sylvestre A.;Defay E.;Raouadi K.;Jomni F.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- dielectric losses;
- dielectric relaxation;
- dielectric thin films;
- grain boundaries;
- permittivity;
- platinum;
- sputter deposition;
- strontium compounds;
- thin film capacitors;
- titanium compounds;
- 0.1 to 1E6 Hz;
- 20 nm;
- 25 to 150 C;
- 50 nm;
- MIM capacitance;
- Pt-SrTiO/sub 3/-Pt;
- S;
53.Digital image correlation and its applications in electronics packaging

机译：数字图像关联及其在电子封装中的应用
- 作者：Sun Yaofeng;Tan Yeow Meng;Pang;J.H.L.;Su Fei
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
54.Direct metal to metal bonding for microsystems interconnections and integration

机译：直接金属对金属键合，用于微系统互连和集成
- 作者：Ang X.F.;Zhang G.G.;Tan B.K.;Wei J.;Chen Z.;Wong C.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
55.Disposable bio-microfluidic package with passive fluidic control

机译：带有被动流体控制的一次性生物微流体包装
- 作者：Ling Xie;Ser Choong Chong;Premachandran;C.S.;Pinjala;D.;Iyer;M.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
56.Drop impact life prediction model for wafer level chip scale packages

机译：晶圆级芯片规模封装的跌落冲击寿命预测模型
- 作者：Kim Yong Goh;Jing-en Luan;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
57.Drop impact life prediction models with solder joint failure modes and mechanisms

机译：具有焊点失效模式和机制的跌落冲击寿命预测模型
- 作者：Jing-en Luan;Tong Yan Tee;Xueren Zhanga;Hussa;E.;Jason Wang;Ford;C.;Jend;K.C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- failure analysis;
- impact testing;
- integrated circuit packaging;
- life testing;
- silver alloys;
- solders;
- tin alloys;
- PDA;
- SnAgCu;
- SnPb;
- bulk solder failure;
- drop impact;
- eutectic solder joint;
- failure mechanisms;
- failure modes;
- integrated circuit packages;
- interfacial brit;
58.Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)

机译：芯片级封装（CSP）的PCB组件的跌落可靠性性能评估
- 作者：Chong;D.Y.R.;Toh;H.J.;Lim;B.K.;Low;P.T.H.;Pang;J.H.L.;Che;F.X.;Xiong;B.S.;Luhua Xu
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- chip scale packaging;
- copper alloys;
- lead alloys;
- printed circuit testing;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- 15 mm;
- CSP;
- PCB assembly;
- PbSnAg;
- SnAgCu;
- chip scale packages;
- drop durability;
- drop orientation;
- drop reliability performance assessment;
- electrol;
59.Drop test reliability improvement of lead-free fine pitch BGA using different solder ball composition

机译：使用不同焊锡球成分改进无铅细间距BGA的跌落测试可靠性
- 作者：Birzer;C.;Rakow;B.;Steiner;R.;Walter;J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- copper alloys;
- failure analysis;
- fine-pitch technology;
- gold alloys;
- impact testing;
- lead alloys;
- nickel alloys;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- JEDEC JESD22-B111;
- SnAgCu;
- SnAgCuNi;
- SnPbAg;
- bulk material;
- drop test reliability improveme;
60.Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

机译：Ni-P厚度对Cu /化学镀Ni-P / Sn-3.5Ag焊点拉伸强度的影响
- 作者：Aditya Kumar;Zhong Chen
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
61.Effect of power cycling duration on coupled power and thermal cycling reliability of board-level chip-scale packages

机译：功率循环持续时间对板级芯片级封装的耦合功率和热循环可靠性的影响
- 作者：Tong Hong Wang;Yi-Shao Lai;Chang-Chi Lee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
62.Effects of lead design on ultrasonic bond quality of wire bonds

机译：引线设计对引线键合超声键合质量的影响
- 作者：Srikanth N.;Vath C.J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
63.Effects of mask patterns optimization and silicon surface preparation for anisotropic silicon etching

机译：掩模图案优化和硅表面制备对各向异性硅刻蚀的影响
- 作者：Tan B.K.;Huang M.;Wei J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- chemical vapour deposition;
- elemental semiconductors;
- etching;
- masks;
- photoresists;
- silicon;
- silicon compounds;
- spin coating;
- CVD approach;
- MEMS devices;
- Si;
- SiO/sub 2/;
- anisotropic etchant;
- anisotropic silicon etching;
- anisotropic wet etching;
- crystal orientation;
- film;
64.Effects of re-finishing of terminations by solder-dipping on plastic quad flatpack electronic parts

机译：通过浸焊对塑料四方扁平包装电子零件重新精加工端子的影响
- 作者：Sengupta S.;Das D.;Ganesan S.;Pecht M.;Lin T.Y.;Rollins W.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
65.Effects of thermal, moisture and mechanical loading conditions on interfacial fracture toughness using Brazil-nut specimens

机译：巴西坚果样品在热，湿气和机械载荷条件下对界面断裂韧性的影响
- 作者：Loo S.;Mhaisalkar S.;Xueren Zhang;Hun Shen Ng;Tong Yan Tee
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
66.Electrical design and specification challenges for high speed serial links

机译：高速串行链路的电气设计和规格挑战
- 作者：Cases;M.;de Araujo;D.N.;Matoglu;E.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
67.Electroless plating of nickel on carbon nanotubes film

机译：在碳纳米管薄膜上化学镀镍
- 作者：Yung K.P.;Wei J.;Tay B.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
68.Electromagnetic susceptibility analysis of high speed circuit inside the shielding enclosure with an aperture

机译：带孔屏蔽罩内部高速电路的电磁敏感性分析
- 作者：Phyu H.N.;Er-Ping Li;Weiliang Y.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
69.Electromigration effect on Cu-pillar(Sn) bumps

机译：电迁移对铜柱（Sn）凸点的影响
- 作者：Lee;S.;Guo;Y.X.;Ong;C.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
70.Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

机译：凸块冶金条件下含Ti / Ni（V）/ Cu的Sn-37Pb和Sn-3Ag-1.5Cu / Sn-3Ag-0.5Cu复合倒装芯片凸块的电迁移可靠性
- 作者：Yi-Shao Lai;Kuo-Ming Chen;Chiu-Wen Lee;Chin-Li Kao;Yu-Hsiu Shao
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- assembling;
- composite material interfaces;
- copper;
- copper alloys;
- electromigration;
- flip-chip devices;
- lead alloys;
- metallurgy;
- nickel;
- reliability;
- silver alloys;
- solders;
- tin alloys;
- titanium;
- 0.4 A;
- 0.5 A;
- 0.6 A;
- 125 C;
- 135 C;
- 150 C;
- Black equation;
- Sn-Pb;
- SnAgCu;
- Ti-Ni-Cu;
71.EMI simulation and measurements of multilayer structures for microprocessor packaging applications

机译：用于微处理器封装应用的多层结构的EMI仿真和测量
- 作者：Rotaru M.D.;Yang Rui;Nhon Do;Mechaik M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
72.Encapsulation and packaging of biosensor

机译：生物传感器的封装
- 作者：Fan;W.;Jeong;Y.W.;Wei;J.;Tan;B.K.;Lok;B.K.;Chun;K.J.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
73.Error proof inkless die bonding process development

机译：防错无墨芯片键合工艺开发
- 作者：Wang ZhiJie;Sonder Wang;Wang J.H.;Yao SuYing;Han R.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
74.Fabrication of low-cost panel sized optical-printed circuit boards

机译：低成本面板尺寸的光学印刷电路板的制造
- 作者：Immonen M.;Rapala-Virtanen T.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
75.Fabrication of thermoelectric cooler for device integration

机译：用于设备集成的热电冷却器的制造
- 作者：Tan Y.M.;Fan W.;Chua K.M.;Shi P.Z.F.;Wong C.K.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- Peltier effect;
- assembling;
- cooling;
- heat pumps;
- surface mount technology;
- thermal stability;
- thermoelectric devices;
- 0.3 mm;
- 0.4 mm;
- 1 mm;
- 3 mm;
- 3.8 mm;
- Peltier effect;
- SMT process;
- TEC module;
- TOSA device;
- device integration;
- dicing process;
- power cycling test;
- semicondu;
76.Fabrication process for high-density wiring interposer using photosensitive multiblock copolyimide insulation layers for 3D packaging

机译：使用用于3D封装的光敏多嵌段共聚酰亚胺绝缘层的高密度布线中介层的制造工艺
- 作者：Kikuchi K.;Oosato H.;Ito S.;Segawa S.;Nakagawa H.;Tokoro K.;Aoyagi M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
77.Failure analysis of sub-50 /spl mu/m lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects

机译：用于倒装芯片互连的化学镀Ni-P UBM上低于50 / splμm/ m的无铅焊料凸点的故障分析
- 作者：Manessis D.;Huang M.;Loeher T.;Ostmann A.;Aschenbrenner R.;Reichl H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- copper alloys;
- failure analysis;
- flip-chip devices;
- gold alloys;
- integrated circuit interconnections;
- integrated circuit metallisation;
- nickel alloys;
- phosphorus alloys;
- silver alloys;
- solders;
- tin alloys;
- (CuNi)/sub 6/Sn/sub 5/;
- 1000 h;
- 150 C;
- 43 micron;
- 47 micron;
- 50;
78.Failure study of Sn-Ag-Cu lead-free solder joint by digital image speckle analysis (DISA)

机译：利用数字图像斑点分析（DISA）研究Sn-Ag-Cu无铅焊点的失效
- 作者：Luhua Xu;Pang;J.H.L.;Faxing Che
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ageing;
- assembling;
- ball grid arrays;
- copper alloys;
- cracks;
- failure analysis;
- silver alloys;
- solders;
- speckle;
- stress effects;
- surface finishing;
- tin alloys;
- voids (solid);
- 25 to 125 C;
- DISA;
- PBGA assemblies;
- SnAgCu;
- crack formation;
- digital image speckle analysis;
- failur;
79.Feasibility study on board assembly of TSSOP components with NiPdAu PPF finish

机译：采用NiPdAu PPF涂层的TSSOP组件板组装的可行性研究
- 作者：Zhao X.J.;Caers J.F.J.M.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- assembling;
- copper alloys;
- eutectic alloys;
- gold alloys;
- lead alloys;
- nickel alloys;
- palladium alloys;
- printed circuit manufacture;
- reflow soldering;
- silver alloys;
- solders;
- tin alloys;
- wetting;
- NiPdAu;
- PPF finish;
- SnAgCu;
- SnPb;
- TSSOP components;
- board assembly;
- component;
80.Finite element analysis on the thermo-mechanical behavior of flip chip packages with Au stud bump and nonconductive paste

机译：带有金柱形凸点和非导电胶的倒装芯片封装热机械性能的有限元分析
- 作者：Yeo;A.;Tan Ai Min;Pei-Siang;S.L.;Lee;C.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
81.Fundamental analysis of VCSEL emission for evaluation of optical coupling efficiency

机译：VCSEL发射的基础分析，用于评估光耦合效率
- 作者：Wakazono;Y.;Kikuchi;K.;Suzuki;A.;Suzuki;K.;Suzuki;S.;Yamaguchi;T.;Nakagawa;H.;Aoyagi;M.;Ibaragi;O.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
82.Growth of aligned carbon nanotube arrays for electrical interconnect

机译：用于电互连的对齐碳纳米管阵列的生长
- 作者：Lingbo Zhu;Yonghao Xiu;Hess D.W.;Wong C.P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- aluminium compounds;
- argon;
- carbon nanotubes;
- catalysts;
- chemical vapour deposition;
- hydrogen;
- integrated circuit interconnections;
- integrated circuit packaging;
- iron;
- lead alloys;
- organic compounds;
- reflow soldering;
- solders;
- tin alloys;
- 13 micron;
- 20 micron;
- ACNT arra;
83.High density vertical probe card fabrication with low cost and high precision characteristics by using MEMS process

机译：利用MEMS工艺制造低成本，高精度的高密度垂直探针卡
- 作者：Jung-Tang Huang;Chung-Yi Lin;Wen-Shiung Lai;Pen-Shan Chao;Sheng-Hsiung Shih
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
84.High frequency characteristics of low temperature processing and high density integrated capacitor on organic substrates

机译：有机基板上低温处理和高密度集成电容器的高频特性
- 作者：Lok;B.K.;Lu;A.C.W.;Fan;W.;Tan;C.K.;Goh;G.K.L.;Chi;D.Z.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
85.High frequency characterization of 100 micron pitch wafer level package interconnects

机译：100微米间距晶圆级封装互连的高频特性
- 作者：Jayabalan;J.;Rotaru;M.D.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
86.High performance conductive adhesives modified with molecular wires

机译：分子线改性的高性能导电胶
- 作者：Yi Li;Wong C.P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
87.High temperature storage (HTS) performance of copper ball bonding wires

机译：铜球焊线的高温存储（HTS）性能
- 作者：Saraswati;Ei Phyu Phyu Theint;Stephan D.;Goh H.M.;Pasamanero E.;Calpito D.R.M.;Wulff F.W.;Breach C.D.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
88.Impact of analog/digital ground design on circuit functionality and radiated EMI

机译：模拟/数字接地设计对电路功能和辐射EMI的影响
- 作者：Hu;B.;See;K.Y.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
89.Impact of drop-in lead free solders on microelectronics packaging

机译：无铅无铅焊料对微电子封装的影响
- 作者：Kai Hwa Chew;Pang J.H.L.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
90.Impact of fatigue modeling on 2/sup nd/ level joint reliability of BGA packages with SnAgCu solder balls

机译：疲劳建模对含SnAgCu焊球的BGA封装的2 / sup / level接头可靠性的影响
- 作者：Stoeckl S.;Yeo A.;Lee C.;Pape H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
91.Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages

机译：实施先进的球形印刷技术以实现晶片芯片级封装的高产量隆起
- 作者：Manessis;D.;Whitmore;M.;Staddon;M.;Ostmann;A.;Aschenbrenner;R.;Reichl;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- chip scale packaging;
- eutectic alloys;
- lead alloys;
- reflow soldering;
- surface mount technology;
- tin alloys;
- 250 micron;
- 300 micron;
- 400 micron;
- 500 micron;
- 6 inch;
- 8 inch;
- Blue Whale program;
- RT07 system on chip;
- SnPb;
- advanced ball printing;
- balling capabilities;
- chip s;
92.Improved slim sector model for analysis of solder joint reliability

机译：改进的细长扇区模型，用于分析焊点可靠性
- 作者：Zhao B.;Tay A.A.O.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
93.Improving the solder joint reliability of VQFN packages

机译：提高VQFN封装的焊点可靠性
- 作者：Stoeckl S.;Pape H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- ball grid arrays;
- fatigue;
- finite element analysis;
- life testing;
- reliability;
- solders;
- 3D FEA model;
- BGA;
- Darveaux fatigue model;
- PCB;
- Robert Darveaux model;
- VQFN packages;
- ball grid arrays;
- crack location;
- mold compound;
- quad flat nonleaded packages;
- solder fatigue li;
94.Industrially compatible PCB stacking technology for miniaturized sensor systems

机译：工业兼容的PCB堆叠技术，用于小型传感器系统
- 作者：Lang;K.D.;Grosser;V.;Jam;K.A.;Wolf;J.;Semionyk;P.;Schmitz;S.;Rochlitzer;R.;Prietzsch;D.;Reichl;H.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
95.Influence of component position on lead-free solder interconnections during drop test

机译：跌落测试期间组件位置对无铅焊料互连的影响
- 作者：Bonnaud;E.L.;Gudmundson;P.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- bending;
- failure analysis;
- impact testing;
- interconnections;
- silver alloys;
- solders;
- tin alloys;
- viscoplasticity;
- SnAgCu;
- analytical modal analysis;
- bending moments;
- component position;
- differential bending;
- drop test;
- failure criterion;
- inelastic strains;
- lead-free sol;
96.Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages

机译：初始孔隙率分布不均匀对电子包装中粘合失败的影响
- 作者：Chew H.B.;Guo T.F.;Cheng L.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
97.Influence of phosphorus content on the interfacial microstructure between Sn-3.5Ag solder and electroless Ni-P metallization on Cu substrate

机译：磷含量对Cu衬底上Sn-3.5Ag焊料与化学镀Ni-P金属界面微结构的影响
- 作者：Mona;Kumar A.;Zhong Chen
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
98.Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM

机译：焊料量对Sn-Ag-Cu焊料与TiW / Cu / Ni UBM之间界面反应的影响
- 作者：Wong C.K.;Pang J.H.L.;Sun Y.F.;Ng F.L.;Tew J.W.;Fan W.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
99.Integrated shadow mask for full angle deposition in fabrication of passive matrix OLED displays

机译：集成阴影掩模，用于无源矩阵OLED显示器制造中的全角度沉积
- 作者：Huang Z.H.;Qi G.J.;Zeng X.T.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
100.Interfacial IMC and Kirkendall void on SAC solder joints subject to thermal cycling

机译：经受热循环的SAC焊点上的界面IMC和Kirkendall空隙
- 作者：Luhua Xu;Pang J.H.L.
- 会议名称：《Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th》 | 2005年
- argon;
- chemical interdiffusion;
- copper alloys;
- silver alloys;
- solders;
- sputter etching;
- thermal management (packaging);
- tin alloys;
- voids (solid);
- Ar;
- Cu-Cu/sub 3/Sn;
- CuSn;
- IMC compounds growth;
- Kirkendall voids formation;
- SAC solder joints;
- SAC/Cu-OSP interface;
- SnAgCu;