...
首页> 外文期刊>Products Finishing >Software Simulates Electroplating --FINITE-ELEMENT ANALYSIS CAN IMPROVE COATING UNIFORMITY
【24h】

Software Simulates Electroplating --FINITE-ELEMENT ANALYSIS CAN IMPROVE COATING UNIFORMITY

机译:软件模拟电镀-有限元分析可以改善镀层的均匀性

获取原文
获取原文并翻译 | 示例
           

摘要

Achieving a uniform finish on complex electroplated components can sometimes be a trial-and-error process that generates a lot of waste as the plating technician struggles to find the right processing conditions. But plating simulation software can minimize the struggle, speed process development, and reduce scrap, according to London-based company HNK-Tech. The company says its finite-element analysis software for plating simulation produces accurate coating uniformity in electroplating with no specialized training required.
机译:在复杂的电镀部件上实现均匀的表面处理有时可能是一个反复试验的过程,由于电镀技术人员努力寻找合适的加工条件,该过程会产生大量浪费。但是,总部位于伦敦的HNK-Tech公司表示,电镀模拟软件可以最大程度地减少工作量,加快工艺开发并减少废品。该公司表示,其用于电镀模拟的有限元分析软件可在电镀过程中产生精确的涂层均匀性,而无需经过专门培训。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号