Fin in the wafer

摘要

Dutch researchers have found a way to make large silicon crystals with a true three-dimensional internal architecture. This substrate platform could be used in faster conventional complementary metal oxide semiconductor electronics, as well as optoelectronics. The computer industry is awaiting the next generation of microprocessors, which are . likely to incorporate 3D elements, with so-called Tin' structures. By increasing surface area, they will be more conductive and powerful, consuming less power compared with conventional 'planar' chips. Yet, these chips are not inherently 3D, but rather comprise of stacked layers of separate chips.