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Formation of porous silicon on a non-conductive substrate and its use as a sacrificial layer

机译:在非导电衬底上形成多孔硅及其作为牺牲层的用途

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摘要

Porous silicon (PS) is an excellent material to be used as a sacrificial layer (SL) for the fabrication of membranes, bridges, cantilevers and other complicated micro-sensor structures. Major advantages of this material are its smooth surface and large area of pores that provide a high rate of PS SL removal. In this work, electrochemical and chemical etching processes of porous silicon formation from polycrystalline silicon deposited on insulating substrates have been studied. It was shown that a sufficiently thick (about 2 μm), uniform PS with a smooth surface and high etching rate in buffered HF solution can be made by both electrochemical and chemical etching from low resistive p-type poly-Si only. Finally, the obtained PS layers have been used as sacrificial layers in a fabrication process of microbolometer array.
机译:多孔硅(PS)是一种极好的材料,可用作制造膜,桥,悬臂和其他复杂的微传感器结构的牺牲层(SL)。这种材料的主要优点是其光滑的表面和大面积的孔洞,可提供较高的PS SL去除率。在这项工作中,已经研究了由沉积在绝缘基板上的多晶硅形成多孔硅的电化学和化学蚀刻工艺。结果表明,仅通过低电阻的p型多晶硅进行电化学和化学刻蚀,就可以制得足够厚(约2μm),具有光滑表面的均匀PS和在HF缓冲溶液中较高的刻蚀速率。最后,在微辐射热计阵列的制造过程中,所获得的PS层已被用作牺牲层。

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