Optimization and application of weights and biases used for correlating metrology collected between steps within a semiconductor process

摘要

To dale the physical models that control the lithographic apparatus are fixed after setup. Problem comes when the process changes beyond the scope of the pre existing physical models. In theory we could develop a new physical model to address the issue, however with the uncertainty in which the issue will remain and issue and when a new issue might pop up, we need a solution that is dynamic enough to quickly fill the gaps between the physical phenomena measured and the physical models used to translate the behavior. For example, it could be that wafer quality measured by alignment can be used as an indicator as to how much of a contribution we should consider between the alignment colors measured paired with leveling metrology. The result is a multidimensional correlation between behavior measured before and after the wafer is exposed.