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Adaptive Virtual Metrology Design for Semiconductor Dry Etching Process Through Locally Weighted Partial Least Squares

机译:局部加权局部最小二乘的半导体干刻工艺自适应虚拟计量设计

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摘要

In semiconductor manufacturing processes, virtual metrology (VM) has been investigated as a promising tool to predict important characteristics of products. Although partial least squares (PLS) is a well-known modeling technique that can cope with collinearity and therefore applied to construction of VM, its prediction performance deteriorates due to changes in process characteristics. In particular, maintenance of equipment strongly affects the process characteristics and the prediction performance. In this paper, VM was developed by using locally weighted PLS (LW-PLS), which is a type of just-in-time modeling technique, and it was used to predict the etching conversion differential of an actual dry etching process. The industrial application results have shown that the developed VM based on LW-PLS is superior to the conventional VM based on the sequential update model and artificial neural network model. In particular, it has been confirmed that the LW-PLS-based VM can keep its high prediction performance even after the maintenance, i.e., replacement of parts.
机译:在半导体制造过程中,虚拟度量(VM)已被研究为预测​​产品重要特性的有前途的工具。尽管偏最小二乘(PLS)是一种众所周知的建模技术,可以解决共线性问题,因此应用于VM的构造,但是由于过程特性的变化,其预测性能会下降。特别是,设备的维护会极大地影响过程特性和预测性能。在本文中,VM是通过使用局部加权PLS(LW-PLS)开发的,这是一种即时建模技术,用于预测实际干法蚀刻工艺的蚀刻转化率差异。工业应用结果表明,基于LW-PLS的虚拟机优于基于顺序更新模型和人工神经网络模型的传统虚拟机。特别地,已经证实即使在维护即部件更换之后,基于LW-PLS的VM也可以保持其高预测性能。

著录项

  • 作者

    Hirai Toshiya; Kano Manabu;

  • 作者单位
  • 年度 2015
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类

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