首页> 外文期刊>Printed Circuit Design & Manufacture >BEST PRACTICES for SMT Design
【24h】

BEST PRACTICES for SMT Design

机译:SMT设计的最佳实践

获取原文
获取原文并翻译 | 示例
           

摘要

Fine-pitch devices and automation levels are resulting in greater board density. There are mechanical and logisti-cal limits to how far these trends can go, however, and the following best practices will help ensure that an SMT device is manufacturable.rnFor fine-pitch devices, designers must be careful to ensure that no natural bridges occur. A natural bridge is a clear, straight track between leads. This creates a trace over which solder can (and likely will) run when soldered (FIGURE 1). Although the result is not technically a defect, it appears as one to automated and human testers. This causes delays and additional manual (i.e., expensive) intervention to check. To avoid natural bridges, traces should be designed to route from the ends of pads, rather than using direct, straight connections.
机译:细间距设备和自动化水平提高了电路板的密度。但是,对于这些趋势的发展方向,存在机械和逻辑上的限制,以下最佳实践将有助于确保SMT设备可制造。对于小间距设备,设计人员必须小心确保没有自然桥出现。自然的桥梁是引线之间的一条清晰,笔直的轨道。这会形成一条迹线,焊接时焊料可以(并且很可能会)流过该迹线(图1)。尽管从技术上讲,结果并不是缺陷,但对于自动测试人员和人工测试人员而言,它似乎是一个缺陷。这导致延迟和额外的人工(即昂贵)干预来检查。为了避免形成自然的桥梁,应将走线设计为从焊盘的末端布线,而不要使用直接的直线连接。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号