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Pop-in events induced by spherical indentation in compound semiconductors

机译:化合物半导体中球形压痕引起的弹入事件

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摘要

Details of the elastic-plastic transitions in crystalline compound semiconductors have been examined using spherical indentation. Two cubic (InP and GaAs) and two hexagonally structured semiconductors (ZnO and GaN) have been studied. A series of indentations have been made in each material at a number of different loads. The resulting load-penetration curves exhibited one or more discontinuities on loading (so called pop-in events). The load at which the initial pop-in event occurred has been measured along with the corresponding indenter extension. The elastic and elastic-plastic response of each material to spherical indentation has been calculated and compared with the experiment. By taking the difference between the elastic and elastic-plastic penetration depths, it has been found that the pop-in extension at each load could be predicted for each material. The detailed deformation behavior of each of the materials during indentation has also been discussed.
机译:已经使用球形压痕检查了晶体化合物半导体中的弹塑性转变的细节。已经研究了两种立方(InP和GaAs)和两种六边形结构的半导体(ZnO和GaN)。每种材料在许多不同载荷下都制成了一系列凹痕。所得的载荷穿透曲线在载荷上表现出一个或多个不连续性(所谓的弹出事件)。初始弹出事件发生时的负载已与相应的压头扩展一起进行了测量。计算了每种材料对球形压痕的弹性和弹塑性响应,并与实验进行了比较。通过取弹性和弹塑性穿透深度之间的差,已发现可以针对每种材料预测每种载荷下的弹起扩展。还讨论了压痕过程中每种材料的详细变形行为。

著录项

  • 来源
    《Journal of Materials Research》 |2004年第1期|p.380-386|共7页
  • 作者单位

    Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra, ACT 0200, Australia;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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