Thermal Simulations of an Electronic System using Ansys Icepak

摘要

Present electronics industry component sizes are efficiently reducing to meet the product requirement with compact size with greater performance in compact size products resulting in different problems from thermal prospective to bring product better performance electrically and mechanically. In this paper we will study how to overcome the thermal problem for a product which includes components reliability and PCB performance by using CFD thermal simulation tool (Ansys Icepak).