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Airflow Management in a Liquid-Cooled Data Center

机译:液冷数据中心的气流管理

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Electronics densification is continuing at an unrelenting pace at the server, rack, and facility levels. With increasing facility density levels, airflow management has become a major challenge and concern. Hot spots, air short-circuiting, and inadequate tile airflow are a few of the issues that are complicating airflow management. This paper focuses on a thermal management approach that simplifies facility airflow management in a cost-effective and efficient manner. Implementation of the technology was undertaken with the DOE's Pacific Northwest National Laboratory. Under the effort, asingle 8.2kW rackof HP rx2600 servers was converted from air cooling to liquid cooling. The liquid-cooling solution employs spray modules that indirectly cool the processors and remove the processor heat load directly to the facility water and not the facility air. An infrared camera was used to measure the temperature distributions over the rear doors of the liquid-cooled rack and several air-cooled racks, as well as the internal areas of a liquid-cooled and an air-cooled server. A tile hood was also used to measure the airflow rate out of all of the perforated tiles in the data center. The air exiting an 8.2 kW air-cooled rack located in a best-case facility location reached a maximum of 34℃ and the air exiting an air-cooled rack located in a worst-case location reached a maximum of 44℃, while the air exiting the liquid-cooled rack was 10℃ to 20℃ cooler, reaching a maximum of 24℃. The air is delivered to the tiles at approximately 14℃. The thermal gradient over the air-cooled racks approximated 10℃ (hottest servers at the top), while that over the liquid-cooled rack was less than half and on the order of 3℃-4℃. The image of the internal areas of the air-cooled server showed some significant hot spots on the power pods and memory, while these were significantly diminished for the liquid-cooled server. The tile airflow measurements revealed that the vast majority of the tiles delivered approximately 725 cfm, with five tiles delivering between 1,300 and 1,480 cfm. This paper provides further details on the study and will analyze the manner in which facility airflow management complexity and cost can be reduced for a liquid-cooled facility.
机译:在服务器,机架和设施级别上,电子技术的密集化正在以不懈的步伐继续进行。随着设施密度水平的提高,气流管理已成为主要的挑战和关注。热点,空气短路和瓷砖气流不足是使气流管理复杂化的一些问题。本文着重于一种热管理方法,以一种经济高效的方式简化设施的气流管理。该技术的实施是在美国能源部的太平洋西北国家实验室进行的。经过努力,HP RX2600服务器的单个8.2kW机架已从空冷转换为液冷。液体冷却解决方案采用喷射模块,这些模块间接冷却处理器,并将处理器的热负荷直接去除到设备水而不是设备空气上。红外摄像头用于测量液冷机架和几个风冷机架的后门上的温度分布,以及液冷和风冷服务器的内部区域。瓷砖罩也被用来测量数据中心所有穿孔瓷砖的气流速率。离开位于最佳情况设施位置的8.2 kW空冷机架的空气最高温度为34℃,离开位于最坏情况场所中的空冷机架的空气最高温度为44℃,而空气离开液冷机架的温度降低了10℃至20℃,最高达到24℃。空气在大约14摄氏度的温度下传送到瓷砖。风冷机架上的温度梯度大约为10℃(顶部是最热的服务器),而液冷机架上的温度梯度则不到一半,约为3℃-4℃。风冷服务器内部区域的图像在电源盒和内存上显示出一些明显的热点,而对于液冷服务器则明显减小了。瓷砖的气流测量结果表明,绝大多数瓷砖的送出量约为725 cfm,其中五块瓷砖的送出量为1300至1,480 cfm。本文提供了有关该研究的更多详细信息,并将分析降低液冷设备的设备气流管理复杂性和成本的方法。

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