首页> 外文期刊>Applied Physics Letters >Molecular beam epitaxy grown template for subsequent atomic layer deposition of high κ dielectrics
【24h】

Molecular beam epitaxy grown template for subsequent atomic layer deposition of high κ dielectrics

机译:分子束外延生长模板,用于随后的高κ电介质原子层沉积

获取原文
获取原文并翻译 | 示例
           

摘要

Molecular beam epitaxy (MBE) grown high k dielectrics of Al_2O_3 and HfO_2 are employed as templates to suppress effectively the oxide/Si interfacial layer formation during the subsequent atomic layer deposition (ALD) growth. The absence of the interfacial layer was confirmed using x-ray photoelectron spectroscopy and high resolution transmission electron microscopy. Two composite films consisting of ALD Al_2O_3(1.9 nm)/MBE v(1.4 nm) and ALD Al_2O_3(3.0 nm)/MBE HfO_2(2.0 nm) showed overall κ values of 9.1 and 11.5, equivalent oxide thicknesses of 1.41 and 1.7 nm, D_(it) of 2.2 x 10~(11) and 2 x 10~(11) cm~(-2) eV~(-1), and leakage current densities of 2.4 x 10~(-2) A/cm~2 at V_(fb)-1 V and 1.1 x 10~(-4) A/cm~2 at V_(fb)+1 V, respectively. The attainment of high dielectric constant suggests that there is no low k capacitor in series near the oxide/Si interface.
机译:Al_2O_3和HfO_2的分子束外延(MBE)生长的高k电介质用作模板,以有效抑制随后的原子层沉积(ALD)生长过程中氧化物/ Si界面层的形成。使用X射线光电子能谱和高分辨率透射电子显微镜确认界面层的不存在。两种由ALD Al_2O_3(1.9 nm)/ MBE v(1.4 nm)和ALD Al_2O_3(3.0 nm)/ MBE HfO_2(2.0 nm)组成的复合膜的总κ值为9.1和11.5,等效氧化物厚度为1.41和1.7 nm, D_(it)为2.2 x 10〜(11)和2 x 10〜(11)cm〜(-2)eV〜(-1),泄漏电流密度为2.4 x 10〜(-2)A / cm〜在V_(fb)-1 V时为2,在V_(fb)+1 V时为1.1 x 10〜(-4)A / cm〜2。高介电常数的获得表明在氧化物/ Si界面附近没有串联的低k电容器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号