机译:温度梯度下在Iiquid-Sn /(111)Cu界面上连续外延生长非常强的Cu_6Sn_5织构
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
机译:在Sn基无铅焊料/非织构多晶Cu板界面处形成的Cu_6Sn_5的外延生长
机译:Sn3.5Ag / Cu界面处形成的Cu_6Sn_5晶粒的织构生长
机译:使用电子背散射衍射在(111)_(Cu)和(001)_(Cu)表面上形成的Cu_6Sn_5纹理的三维放置规则
机译:通过施加温度梯度Sn /(001)Cu接口Cu_6Sn_5晶粒的生长行为
机译:强极化电流径向梯度和平行非线性对环形离子温度梯度驱动的湍流的陀螺动力学粒子模拟。
机译:低温还原气氛下PLD在立方织构的Cu复合衬底上外延生长SrTiO3薄膜
机译:在温度梯度下液体-SN /(111)Cu接口下极强CU6SN5纹理的连续外延生长
机译:外延YBa2Cu3O7薄膜在轧制织构金属上用于高温超导应用