Die attach: Today's challenges

摘要

In back-end semiconductor manufacturing, the die attach process is a critical step. In simple terms, die attach is picking a chip from a wafer and placing it onto a substrate or metal lead frame. The way the chip is bonded defines the die attach process ― epoxy, soft solder, eutectic and flip chip are the most widely used techniques. Die attach seems to be a simple process step in the semiconductor manufactur-ing chain. However, the continuously escalating requirements of today's applications create difficult challenges in/die bonding.