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The Current Collapse in AlGaN/GaN High-Electron Mobility Transistors Can Originate from the Energy Relaxation of Channel Electrons?

机译:AlGaN / GaN高电子迁移率晶体管中的电流崩塌是否可能源于沟道电子的能量弛豫?

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摘要

Influence of the energy relaxation of the channel electrons on the performance of AlGaN/GaN high-electron mobility transistors (HEMTs) has been investigated using self-consistent solution to the coupled Schrödinger equation and Poisson equation. The first quantized energy level in the inversion layer rises and the average channel electron density decreases when the channel electric field increases from 20 kV/cm to 120 kV/cm. This research also demonstrates that the energy relaxation of the channel electrons can lead to current collapse and suggests that the energy relaxation should be considered in modeling the performance of AlGaN/GaN HEMTs such as, the gate leakage current, threshold voltage, source-drain current, capacitance-voltage curve, etc.
机译:已经使用耦合Schrödinger方程和Poisson方程的自洽解研究了沟道电子的能量弛豫对AlGaN / GaN高电子迁移率晶体管(HEMT)性能的影响。当沟道电场从20 kV / cm增加到120 kV / cm时,反型层中的第一量化能级升高,平均沟道电子密度降低。这项研究还表明,沟道电子的能量弛豫会导致电流崩溃,并建议在对AlGaN / GaN HEMT的性能进行建模时应考虑能量弛豫,例如栅极漏电流,阈值电压,源漏电流,电容-电压曲线等

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