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Rapid thermal annealing for high-quality ITO thin films deposited by radio-frequency magnetron sputtering

机译:快速热退火用于射频磁控溅射沉积的高质量ITO薄膜

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摘要

In this work, rapid thermal annealing (RTA) was applied to indium tin oxide (ITO) films in ambient atmosphere, resulting in significant improvements of the quality of the ITO films that are commonly used as conductive transparent electrodes for photovoltaic structures. Starting from a single sintered target (purity 99.95%), ITO thin films of predefined thickness (230 nm, 300 nm and 370 nm) were deposited at room temperature by radio-frequency magnetron sputtering (rfMS). After deposition, the films were subjected to a RTA process at 575 °C (heating rate 20 °C/s), maintained at this temperature for 10 minutes, then cooled down to room temperature at a rate of 20 °C/s. The film structure was modified by changing the deposition thickness or the RTA process. X-ray diffraction investigations revealed a cubic nanocrystalline structure for the as-deposited ITO films. After RTA, polycrystalline compounds with a textured (222) plane were observed. X-ray photon spectroscopy was used to confirm the beneficial effect of the RTA treatment on the ITO chemical composition. Using a Tauc plot, values of the optical band gap ranging from 3.17 to 3.67 eV were estimated. These values depend on the heat treatment and the thickness of the sample. Highly conductive indium tin oxide thin films (ρ = 7.4 × 10−5 Ω cm) were obtained after RTA treatment in an open atmosphere. Such films could be used to manufacture transparent contact electrodes for solar cells.
机译:在这项工作中,将快速热退火(RTA)应用于环境大气中的铟锡氧化物(ITO)膜,从而显着改善了通常用作光伏结构导电透明电极的ITO膜的质量。从单个烧结靶(纯度为99.95%)开始,通过射频磁控溅射(rfMS)在室温下沉积预定厚度(230 nm,300 nm和370 nm)的ITO薄膜。沉积后,将膜在575°C(加热速率20°C / s)下进行RTA处理,在此温度下保持10分钟,然后以20°C / s的速度冷却至室温。通过改变沉积厚度或RTA工艺来改变膜结构。 X射线衍射研究表明,所沉积的ITO膜具有立方纳米晶体结构。在RTA之后,观察到具有织构(222)面的多晶化合物。 X射线光子光谱用于确认RTA处理对ITO化学成分的有益作用。使用Tauc曲线,可以估算出3.17至3.67 eV范围内的光学带隙值。这些值取决于热处理和样品的厚度。在露天气氛中进行RTA处理后,可获得高导电性的铟锡氧化物薄膜(ρ= 7.4×10 -5 Ωcm)。这样的膜可以用于制造用于太阳能电池的透明接触电极。

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