Process for magnetron sputtering for depositing thin layers for coating glass, plastic films, metals, electrical components and other substrates comprises initially impinging a magnetron source and/or partial target with a magnetic field

摘要

Process for magnetron sputtering comprises impinging a magnetron source and/or partial target with a magnetic field selected for optimum sputtering in the phases connected to the negative pole of a current supply unit, and impinging with a magnetic field selected for forming an optimum structure of the layers deposited in the phases connected to the positive pole of the current supply unit. With each reversal of the polarity affected by the current supply unit, the magnetic field strength assigned to the magnetron source and/or partial target are reversed.