高导热率低膨胀复合型硅橡胶及导热填料研究进展

摘要

Advances in the high thermal conductivity and low expansion rate silicone rubber and thermally con-ductive filler were summarized.First,the common thermally conductive filler and basic properties of thermally conductive filler were introduced,including metals,oxides,nitrides,carbides,etc..And the performance characteristics of various types of thermally conductive filler was described in detail and pointed out the influ-ence of the basic performance of the thermal conductivity on thermal conductivity,including filler ratio,size, size distribution,shape and surface properties of the filler and so on.Followed by a detailed description of the basic ways to improve thermal conductivity were given,including introduction of thermal conductivity mecha-nism;matrix materials research;development of new high-performance thermally conductive filler;conduct thermally conductive filler surface modification;silicone rubber molding process optimization,etc..Then some basic ways to reduce the coefficient of thermal expansion were introduced,including modification of inorganic nanoparticles and so on.Finally,some of the basic problems acurrently existing in the field and some ideas of solutions were advanced and the development trends were prospected.%主要综述了高导热率低膨胀加成型硅橡胶及导热填料的研究进展。首先介绍了常见的导热填料及其基本性能，主要包括金属类、氧化物类、氮化物类、碳化物类等；详细描述了各类填料的性能特点，并指出了填料基本性能对导热系数的影响，主要包括填料的比例、尺寸、尺寸分布、形状及填料的表面性质等。其次详细介绍了提高导热系数的基本途径，主要包括导热机理介绍；基体材料研究；研发新型高性能导热填料；进行导热填料表面改性；对硅橡胶成型工艺进行优化等；然后介绍了降低热膨胀系数的一些基本途径，主要包括无机纳米粒子改性等。最后指出了目前该研究领域存在的一些基本问题及解决思路，并对未来的发展方向进行了展望。