纳米银焊膏烧结大功率LED模块的高温可靠性研究

摘要

介绍了一种加速老化试验模型对LED模块进行寿命预测。分别采用纳米银焊膏、锡银铜焊料、导电银胶作为芯片粘结材料。控制环境温度和正向电流，在特定的时间测量光输出。比较了不同粘接材料及环境温度对LED老化过程的影响，并针对老化过程进行分析推导，建立老化数学模型，对其进行寿命预测。试验结果表明，纳米银焊膏粘接的模块对温度的抗性最好，纳米银焊膏有潜力在未来固态照明、投影和其他高功率器件领域得到应用。%A general procedure for accelerated degradation testing ( ADT) was presented to predict the lifetime of three kinds of LED modules. The die attach materials of LED modules were nano-sil-ver paste, Sn3Ag0. 5Cu (Sn-based alloys), silver epoxy, respectively. The ambient temperature and forward current were controlled, and the light output at several time points was measured. The degradation mechanism of LEDs modules was analyzed. The lifetimes of LED modules under the condition of different die attach materials were predicted. The test results show that the nano-silver paste is a very promising die-attach material for the aging of multi-chip high power LED modules.