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LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATURE APPLICATIONS
LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATURE APPLICATIONS
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机译:无铅焊膏用混合焊膏粉末用于高温应用
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摘要
Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10wt% to 90wt% of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt% ratio of Sn:Sb of 0.75 to 1.1; 10wt% to 90wt% of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80wt% of Sn; and a remainder of flux.
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