首页> 外文学位 >Electron transport in epitaxial metal films studied by ballistic electron emission microscopy and the resisitivity measurements.
【24h】

Electron transport in epitaxial metal films studied by ballistic electron emission microscopy and the resisitivity measurements.

机译:通过弹道电子发射显微镜和电阻率测量研究了外延金属膜中的电子传输。

获取原文
获取原文并翻译 | 示例

摘要

The studies of electron transport in thin metallic films are motivated by a need to understand how electron reflections at metal surfaces and interfaces affect the resistivity of thin interconnect lines in chips. In this Thesis, we have characterized the resistivity of thin Al(111) and Cu(111) films that were grown on CaF2/Si(111) by molecular beam epitaxy (MBE), and performed ballistic electron emission microscopy (BEEM) investigations of thin Al films. The structure of the films was studied by reflection high-energy electron diffraction (RHEED), scanning tunneling microscopy (STM), atomic force microscopy (AFM), and transmission electron microscopy (TEM).; It was found that nearly single crystal epitaxial Al grows directly on CaF2, while epitaxial Cu can be grown only on an Al seed layer. The resistivity increase in thin Al films agreed with a model that assumed complete diffuse electron scattering at surfaces and a value of 15.5 ± 1.5 nm for the mean free path of the conduction electrons. For Cu, the resistivity increase in thin films was too large to be explained by diffuse surface scattering, and was attributed to scattering at grain boundaries.; In the course of studying thin film resistivity, we have also developed a technique to measure thickness of nanometer-thick films by AFM, a method to initiate the CaF2 growth without exposing bare Si surface to vacuum, and a simple formula to estimate influence of thickness inhomogeneity on the effective film resistivity.; The BEEM experiments on Al films deposited on Au/Si, aimed at obtaining more information about the electron transport in Al, resulted in the hot electron attenuation length values between 1.4 nm and 1.8 nm. Such small values were attributed to high defect density in the samples, resulting from alloying between Al and Au.; On the other hand, we have shown theoretically that the BEEM attenuation length may be several times shorter than the resistivity-measured mean free path, even if the main scattering mechanism is due to phonons in both cases. These calculations highlighted different sensitivity of the two techniques to small-angle scattering events, and necessity to consider angular dependence of scattering probability in simulations of electron transport in metals.
机译:需要了解金属表面和界面上的电子反射如何影响芯片中薄互连线的电阻率,从而推动了金属薄膜中电子传输的研究。在本文中,我们表征了通过分子束外延(MBE)在CaF 2 / Si(111)上生长的Al(111)和Cu(111)薄膜的电阻率,并进行了弹道铝薄膜的电子发射显微镜(BEEM)研究。通过反射高能电子衍射(RHEED),扫描隧道显微镜(STM),原子力显微镜(AFM)和透射电子显微镜(TEM)研究了膜的结构。发现几乎单晶的外延Al直接在CaF 2 上生长,而外延Cu只能在Al籽晶层上生长。 Al薄膜中电阻率的增加与一个模型一致,该模型假定表面上存在完全的散射电子散射,并且传导电子的平均自由程值为15.5±1.5 nm。对于Cu,薄膜的电阻率增加太大,无法用漫射表面散射来解释,并且归因于在晶界处的散射。在研究薄膜电阻率的过程中,我们还开发了一种通过原子力显微镜测量纳米厚膜厚度的技术,一种在不使裸露的硅表面暴露于真空的情况下引发CaF 2 生长的方法,以及一个简单的公式来估算厚度不均匀性对有效膜电阻率的影响。为了获得有关Al中电子传输的更多信息,对在Au / Si上沉积的Al膜进行BEEM实验,得到的热电子衰减长度值在1.4 nm和1.8 nm之间。这么小的值归因于样品中高的缺陷密度,这是由于铝和金之间的合金化所致。另一方面,从理论上讲,即使在两种情况下,主要的散射机理都由声子引起,但BEEM衰减长度可能比电阻率测量的平均自由程短几倍。这些计算突显了两种技术对小角度散射事件的不同敏感性,并且有必要在模拟金属中电子传输时考虑散射概率的角度依赖性。

著录项

  • 作者单位

    Rensselaer Polytechnic Institute.;

  • 授予单位 Rensselaer Polytechnic Institute.;
  • 学科 Physics Condensed Matter.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 140 p.
  • 总页数 140
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号