METHOD FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, METHOD FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, METHOD FOR DESIGNING PACKAGE, METHOD FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DEVICE FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE, AND SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PPROBLEM TO BE SOLVED: To provide a method for designing a semiconductor integrated circuit system excellent in thermal characteristics by which a semiconductor integrated circuit can be designed with excellent operability even in making a semiconductor integrated circuit large in circuit scale and high in integration. PSOLUTION: This method for designing semiconductor integrated circuit system comprises: a first process for designing a package including a casing in which a system is housed and a mounting substrate housed in the casing configuring this system and a package substrate mounted on the mounting substrate based on system specification information; a process for carrying out the thermal analysis of the mounting substrate and the package in the casing based on the design result acquired in the process for carrying out the design; and a second process for designing the semiconductor integrated circuit system based on the analytic result of the process for carrying out the thermal analysis. It is desired that the semiconductor integrated circuit loaded on the package is designed so that the element arrangement of the semiconductor integrated circuit can be determined in the second process. PCOPYRIGHT: (C)2008,JPO&INPIT