首页> 外文会议>VLSI Design, Automation and Test, 2009. VLSI-DAT '09 >On chip Communication-Architecture Based Thermal Management for SoCs
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On chip Communication-Architecture Based Thermal Management for SoCs

机译:基于片上通信架构的SoC热管理

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In current systems-on-chip (SoC) designs, managing peak temperature is critical to ensure operation without failure. Our novel communication architecture based thermal management (CBTM) scheme manages thermal behavior of components by delaying the execution of chosen IP-blocks or components by regulating the flow of data over the on-chip communication bus. This temperature aware traffic flow over the bus is achieved by dynamically changing the communication priority table in response to thermal readings from sensors. With CBTM, the temperatures of individual components can be controlled selectively. In this paper we demonstrate the effectiveness of CBTM on four industrial size SoC designs and also evaluate its performance impact. We observe that CBTM maintained thermal thresholds and reduced the peak temperature of an SoC by as much as 29degC.
机译:在当前的片上系统(SoC)设计中,管理峰值温度对于确保无故障运行至关重要。我们新颖的基于通信架构的热管理(CBTM)方案通过调节片上通信总线上的数据流来延迟所选IP块或组件的执行,从而管理组件的热行为。通过响应传感器的热读数动态更改通信优先级表,可以实现总线上的这种温度感知流量。使用CBTM,可以有选择地控制各个组件的温度。在本文中,我们演示了CBTM在四种工业规模SoC设计上的有效性,并评估了其性能影响。我们观察到CBTM保持了温度阈值,并使SoC的峰值温度降低了29degC。

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