Characterization of copper surfaces using if electronic circuit boards by reflectance Ft_Ir

摘要

Organic and organo-metallic onatings are presently being applied over bare copper as an approach to improve the co-planarity of circuit boards. Conformal organic solderability preservative coatings (OSP) are environmentally and economically advantageous over the more commonly used lead based coatings [1-2]. Problems arise in assessing the solderability of the bare copper and the integrity of the organic coating.