HIGH PRESSURE SENSOR BASED ON FUSION BONDING

摘要

In this paper we present a silicon based pressure sensor for high pressure applications. The sensor is based on fusion bonding and designed for a simple and a low-cost encapsulation scheme. The sensor can be designed for a maximum pressure in the range from 35 bar to 1500 bar and temperatures ranging from -40℃ to 120℃ and has a burst pressure exceeding 3000 bar. For proper performance of the sensor it is essential that the fusion bond interface is hermetic tight which will be one of the issues for discussion in this paper. Sensor design, fabrication and performance of the sensor will further be presented.