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Carbon- and Tin- Incorporated Source/Drain Stressors for CMOS Transistors

机译:碳和锡结合的CMOS晶体管源极/漏极应力源

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We explore several technology options for forming latticemismatchedrnsource/drain (S/D) stressors for enhancing thernperformance of complementary metal-oxide-semiconductorrn(CMOS) field-effect transistors. Recent research on silicon-carbonrn(Si:C or Si1-yCy) S/D stressors for n-FETs will be reviewed.rnDevice integration work involving epitaxial Si:C S/D with highrncarbon concentration and in situ doping, as well as alternativerntechnologies for forming Si:C S/D, e.g. using implantation andrnanneal, will be discussed. For p-FETs, tin-incorporated S/Drnstressors will be explored. Integration of new stressors inrnadvanced device architectures is expected to enable the realizationrnof ultimate CMOS performance.
机译:我们探索了几种形成晶格失配的源极/漏极(S / D)应力源的技术选择,以增强互补金属氧化物半导体(CMOS)场效应晶体管的性能。本文将对用于n-FET的碳硅(Si:C或Si1-yCy)S / D应力源的最新研究进行综述.n器件集成工作涉及具有高碳浓度和原位掺杂的外延Si:CS / D以及替代技术形成Si:CS / D,例如将使用植入和退火进行讨论。对于p-FET,将探索掺锡的S / Drnstressor。新的压力源的先进器件架构的集成有望实现最终的CMOS性能。

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