首页> 外文会议>SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices >Defect Reduction of Ge on Si by Selective Epitaxy and Hydrogen Annealing
【24h】

Defect Reduction of Ge on Si by Selective Epitaxy and Hydrogen Annealing

机译:通过选择性外延和氢退火减少Si上Ge的缺陷

获取原文
获取原文并翻译 | 示例

摘要

We demonstrate a promising approach for the monolithicrnintegration of Ge-based nanoelectronics and nanophotonics withrnSilicon: the selective deposition of Ge on Si by Multiple HydrogenrnAnnealing for Heteroepitaxy (MHAH). Very high quality Gernlayers can be selectively integrated on Si CMOS platform with thisrntechnique. We confirm the reduction of dislocation density in Gernlayers using AFM surface morphology study. In addition, in siturndoping of Ge layers is achieved and MOS capacitor structures arernstudied.
机译:我们展示了一种有前途的锗基纳米电子和纳米光子与硅单片集成的方法:通过多氢退火异质外延(MHAH)在Si上选择性沉积Ge。这项技术可以将高质量的Gernlayers选择性地集成到Si CMOS平台上。我们使用AFM表面形态学研究证实了Gernlayers中位错密度的降低。另外,实现了Si层的单向掺杂,并研究了MOS电容器的结构。

著录项

  • 来源
  • 会议地点 Honolulu HI(US);Honolulu HI(US)
  • 作者单位

    Department of Electrical Engineering, Stanford University, Stanford, CA 94305 USA;

    rnDepartment of Electrical Engineering, Stanford University, Stanford, CA 94305 USA;

    rnDepartment of Electrical Engineering, Stanford University, Stanford, CA 94305 USA Department of Electrical and Electronics Engineering, Bilkent University, Ankara,06800 Turkey;

    rnDepartment of Electrical Engineering, Stanford University, Stanford, CA 94305 USA;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 表面处理;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号