Ibss Based PCB Technology for High Pin Count / Fine Pitch Package Assembly

摘要

IBSS Based PCB Technology for High Pin Count / Fine Pitch Package Assembly Since TCP, BGA and CSP applications are increasing in high density packaging market, their mother board technology, which can deal with high density footprints without solder bridge problems, has become more and more important. We have developed a new packaging substrate technology, IBSS (IPN Build-up Structure System), mainly for MCM-L. Using its features, such as fine pattern by full-additive process, small via connection by photo-vias and high reliability of build-up structure by IPN insulation layer resin, we studied the dtructures and design rules of high density mother board applications as well as IC packaging substrates. IBSS based boards appear to be suitable for the coming high density and high pin count package assembly in both mother board and packaging substrates applications with its high reliability of soldering and high design flexibility.