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AlAs/InAlAs-InGaAs QCLs grown by gas-source molecular-beam epitaxy

机译:气源分子束外延生长的AlAs / InAlAs-InGaAs QCL

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Active region designs of QCLs containing composite barriers based on AlAs allow short wavelength emission, improved injection efficiency, and high values of T_0 and T_1. On the other hand, AlAs introduces challenges, not only in strain compensation and growth, but also in effects on thermal management, thermal stability, and scattering. Leakage current, allowing electrons to bypass transitions between upper and lower laser levels occur due to scattering of electrons into higher-lying states via phonons and interface roughness scattering. This interface roughness scattering is exacerbated by large values of ΔE_c and by the rms roughness itself, both of which are pronounced at the AlAs/InGaAs interface. The resulting leakage current noticeably reduces the slope efficiency, leading to more heating to achieve a given emission power. Efficient thermal management requires a buried heterostructure design;the re-growth of InP:Fe, however, needs to be carried out at temperatures consistent with maintaining the highly strained AlAs/InGaAs interfaces. This paper describes the physics of intersubband electron scattering due to strained interfaces and some partially optimized structures with J_(th) = 1.7 kA/cm~2 at 300 K, slope efficiency η = 1.4 W/A, T_0 = 175 K, and T_1 = 550 K. Re-growth of InP:Fe using gas-source MBE at substrate temperatures below 550 ℃ results in packaged lasers with 7μm width having high thermal conductance.
机译:包含基于AlAs的复合势垒的QCL的有源区设计可实现短波长发射,提高的注入效率以及高T_0和T_1值。另一方面,AlAs不仅在应变补偿和增长方面,而且在对热管理,热稳定性和散射的影响方面都带来挑战。漏电流,是由于电子通过声子和界面粗糙度的散射而散射到较高的状态,从而使电子绕过上下激光能级之间的过渡。较大的ΔE_c值和均方根粗糙度本身会加剧这种界面粗糙度的散射,这两者在AlAs / InGaAs界面上均很明显。产生的泄漏电流明显降低了斜率效率,导致更多的热量以达到给定的发射功率。高效的热管理需要掩埋异质结构设计;然而,InP:Fe的重新生长必须在与维持高应变AlAs / InGaAs界面一致的温度下进行。本文描述了在300 K,斜率效率η= 1.4 W / A,T_0 = 175 K和T_1时界面应变和部分优化结构在J_(th)= 1.7 kA / cm〜2时由于子带间电子散射的物理现象。 = 550K。在550℃以下的衬底温度下使用气源MBE再生InP:Fe可以得到宽度为7μm的封装激光器,具有高导热性。

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