首页> 外文会议>International Test Conference >Defect Oriented Testing of the Strap Problem Under Process Variations in DRAMs
【24h】

Defect Oriented Testing of the Strap Problem Under Process Variations in DRAMs

机译:在DRAM中的过程变化下的带状问题的缺陷导向测试

获取原文

摘要

Efficient and effective methods are needed to generate defect oriented tests for todays VLSI circuits. This paper describes an industrial case study for using defect injection and Spice simulation to generate defect oriented tests for the so-called strap defects in DRAMs, taking both the sensitivity of this defect to process variations and bit line coupling into consideration. The paper discusses all the different stages of the test generation process, starting with defect modeling, followed by the simulation methodology, test generation and optimization, and finally test application and industrial evaluation performed in Qimonda. Results show that the generated tests have the same coverage as previously used tests with possible test time reduction of up to 59%. The analysis also identifies the slow process corner and the data backgrounds 11 and 01 as the most stressful combinations to test the strap. The paper also discusses a test method used to account for process variations and detect the fault in any process corner.
机译:需要高效且有效的方法来为今天的VLSI电路产生缺陷导向的测试。本文介绍了使用缺陷注射和香料仿真的工业案例研究,以产生DRAM中所谓的带状缺陷的缺陷导向测试,从而考虑了处理变化和位线耦合的敏感性。本文讨论了测试生成过程的所有不同阶段,从缺陷建模开始,其次是仿真方法,试验和优化,以及在QIMONDA进行的测试应用和工业评估。结果表明,生成的测试具有与先前使用的测试相同的覆盖率,可能的测试时间降低高达59%。分析还将缓慢的过程角和数据背景11和01标识为测试表带的最紧张组合。本文还讨论了用于解释过程变化的测试方法,并在任何过程角落中检测故障。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号