【24h】

X-band rectangular microstrip patch antenna on Si substrate using IC process

机译:SI基板上的X波段矩形微带贴片天线使用IC工艺

获取原文

摘要

Rectangular microstrip Patch Antenna has been most popular and innovative topics among designers in recent years owing to easily implementable and availability of numerous analysis methods. It is having vast applications covering mobile to satellite communication. A rectangular microstrip patch antenna has been designed and developed on Si substrate suitable for RFIC circuits. The antenna design is carried out at 8.2GHz and fabricated on High resistivity Si substrate [1]. Design of Antenna on high dielectric constant substrate is advantageous in terms of small size and reduced weight, but tightly coupled filed in it causes less space radiation. Insulating thin layer of SiO2 is employed as base material over silicon to avoid formation of metal-semiconductor junction (Schottky Barrier). In this article design of microstrip patch using full wave simulation and analysis of measured results is discussed.
机译:矩形微带贴片天线在近年来设计师中最受欢迎,创新的主题,因为众多分析方法的可用性可实现和可用性。它具有覆盖移动到卫星通信的广泛应用。在适用于RFIC电路的Si衬底上设计和开发了一个矩形微带贴片天线。天线设计在8.2GHz下进行,并在高电阻率Si衬底上制造[1]。在高介电常数基板上的天线设计在小尺寸和减轻的重量方面是有利的,但是在其中提起的紧密耦合导致空间辐射较少。绝缘薄层SiO 2用作硅上的基材,以避免形成金属半导体结(肖特基屏障)。在本文中,讨论了使用全波模拟和测量结果分析的微带贴片的设计。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号