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X-band rectangular microstrip patch antenna on Si substrate using IC process

机译:使用IC工艺在Si基板上的X波段矩形微带贴片天线

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摘要

Rectangular microstrip Patch Antenna has been most popular and innovative topics among designers in recent years owing to easily implementable and availability of numerous analysis methods. It is having vast applications covering mobile to satellite communication. A rectangular microstrip patch antenna has been designed and developed on Si substrate suitable for RFIC circuits. The antenna design is carried out at 8.2GHz and fabricated on High resistivity Si substrate [1]. Design of Antenna on high dielectric constant substrate is advantageous in terms of small size and reduced weight, but tightly coupled filed in it causes less space radiation. Insulating thin layer of SiO2 is employed as base material over silicon to avoid formation of metal-semiconductor junction (Schottky Barrier). In this article design of microstrip patch using full wave simulation and analysis of measured results is discussed.
机译:矩形微带贴片天线由于易于实施和多种分析方法而成为近年来设计人员中最流行和创新的话题。它具有涵盖移动到卫星通信的广泛应用。已经在适合RFIC电路的Si基板上设计和开发了矩形微带贴片天线。天线设计在8.2GHz频率下进行,并在高电阻率Si衬底上制造[1]。在高介电常数衬底上的天线设计在小尺寸和减轻重量方面是有利的,但是紧密耦合在其中引起较少的空间辐射。 SiO2绝缘薄层用作硅上的基础材料,以避免形成金属-半导体结(肖特基势垒)。在本文中,讨论了使用全波仿真设计微带贴片并分析测量结果的方法。

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