CO_2 Laser Induced Blind-via for Direct Electroplating

摘要

Blind-via plays a crucial role in interlayer interconnection of printed circuit board. To get the blind via metallized a direct electroplating process has been put forward by the way of a inducing CO_2 laser beam irradiating the copper in the bottom of blind via. The method for direct electroplating of copper onto a non-copper platable layer has been investigated in blind via metalization. The regression analysis was used to discuss the laser beam energy in different parameters. The results of electroplated blind via showed that the copper in the bottom of blind via can be induced by CO_2 laser, and the induced copper particles ejected to the hole wall plays a role of the conductive film layer that mainly composed of copper by electroless plating or carbon black conductive film during electroplating, plasma used in cleaning blind via can promote the sorption of induced copper particles onto the via wall.