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Influence of Deposition Time on the Surface Morphology and Photoelectrochemical Properties of Copper Doped Titania Nanotubes Prepared by Electrodeposition

机译:沉积时间对电沉积铜掺杂二氧化钛纳米管表面形态和光电化学性质的影响

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A great attention has focused on Cu doped titania nanotubes (Cu/TiNT) as a versatile advance material since it can be employed in various promising techno logical applications. The current study reported on the influence of various deposition times on the surface morphology and photoelectrochemical properties of Cu/TiNT via electrodeposition technique. Cu loaded on the TiNT surface was detected with prolonged deposition time. For photoelectrochemical (PEC) measurement, the highest responsive photocurrent density was obtained at 20 minutes with 54.3 μA/cm~2. Too long duration (40 mins) resulted in poor performance of Cu/TiNT as only 22.6 μA/cm~2 of photocurrent being generated.
机译:极大的注意力集中在Cu掺杂的二氧化钛纳米管(Cu / Tint)作为通用的先进材料,因为它可以在各种有前途的技术逻辑应用中使用。 目前的研究报告了各种沉积时间对Cu /色调通过电沉积技术的表面形态和光电化学性质的影响。 用延长的沉积时间检测装载在色调表面上的Cu。 对于光电化学(PEC)测量,用54.3μA/ cm〜2的20分钟获得最高响应光电流密度。 太长的持续时间(40分钟)导致Cu / Tint的性能差,仅产生22.6μA/ cm〜2的光电流。

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