In the manner which with the electropainting forms dielectric filler content polyimide coat on the metal material surface making use of the dielectric filler content polyimide electrodeposition liquid which makes the dielectric filler contain in the copper-clad laminate null polyimide electrodeposition liquid which

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a dielectric layer comprising a dielectric filler and having excellent film thickness uniformity by using a dielectric filler-containing polyimide electrodeposition liquid.;SOLUTION: In the method, a dielectric filler-containing polyimide film is formed on the surface of a metallic material by an electrodeposition coating method. As the dielectric filler, dielectric powder in which the average particle diameter D_IA is 0.05 to 1.0 m, and the weight cumulative particle diameter D₅₀ by a laser diffraction scattering type particle diameter distribution measuring method is 0.1 to 2.0 m, and also, the value of an flocculated degree expressed by D₅₀/D_IA using the weight cumulative particle diameter D₅₀ and the average particle diameter D_IA obtained by image analysis is 4.5, and having a perovskite structure with an almost spherical shape is used.;COPYRIGHT: (C)2004,JPO