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Temperature dependence of conduction current in silicon oxynitride films grown by PECVD

机译:通过PECVD生长的氧氮化硅膜中的传导电流的温度依赖性

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Silicon oxynitride films with different nitrogen contents were deposited by plasma enhanced chemical vapor deposition. Electrical conduction current was found to be enhanced if the films were annealed at high temperatures. In order to investigate this reason, the temperature (T) dependence of conduction current density (J) was measured. It was found that the conduction current was found to be governed by the Poole-Frenkel effect and that the activation energy estimated from the J-T relation decreases with an increase in the annealing temperature. Electron spin resonance spectroscopy and Fourier-transform infrared spectroscopy revealed that hydrogen atoms present abundantly in the films terminate silicon-, nitrogen-, and oxygen-related dangling bonds. These atoms are detached by the annealing, resulting in the many localized states that enhance carrier transport.
机译:通过等离子体增强的化学气相沉积沉积具有不同氮含量的氧氮化硅膜。如果在高温下退火,则发现电导电流得到增强。为了调查这个原因,测量导电电流密度(j)的温度(t)依赖性。发现导电电流被发现由普尔弗雷克尔效应控制,并且从J-T关系估计的激活能量随着退火温度的增加而降低。电子自旋共振光谱和傅立叶变换红外光谱显示,氢原子在薄膜中大量存在于硅 - ,氮气和氧相关的悬空键。这些原子通过退火脱离,导致众多局部状态增强载流子。

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