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Modeling electrodeposition in LIGA micro-fabrication using an arbitrary Lagrangian-Eulerian formulation for moving-boundary tracking with repeated re-meshing

机译:利用拉格朗日 - 欧拉配方对LIGA微型制造中的电沉积电沉积,用于重复重新啮合的移动边界跟踪

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Electrodeposition is a key process in LIGA (Lithographic, Galvanoformung, Abformung -German words for lithography, electroplating and molding) microfabrication, which is increasingly demonstrated to be a viable technology for fabricating micro-devices or parts. LIGA Electrodeposition involves complex multi-physics phenomena: 1) diffusion, migration, and convection of charged species in a centimeter-scale electrolyte-bath region and in micron-scale feature-cavity or trench regions; 2) homogeneous and heterogeneous electrochemical reactions; and 3) moving deposition surface or surfaces on which metal ions (e.g., Ni~(2+)) are electrochemically reduced to form a pure metal or an alloy. In this paper we report efforts toward developing a predictive multidimensional computer model for simulating electrodeposition in LIGA microfabrication. A Poisson equation that explicitly describes electrolyte potential is derived by combining the species mass conservation equations and the electroneutrality constraint. Mesh-motion equations that employ an arbitrary Lagrangian-Eulerian formulation, and species-mass, charge and momentum conservation equations are solved using GOMA in parallel computations. GOMA is a multi-physics multi-dimensional finite-element computer code developed and being enhanced at Sandia National Laboratories. In the present work, homogeneous reactions are taken to be infinitely fast whereas metal-ion reduction reaction on the deposition surface is assumed to obey Butler-Volmer kinetics. Sample results are presented for electrolyte potential, species concentrations, flow field, and positions of the deposition surface for nickel electrodeposition in a two-dimensional trench. To handle the dramatic reduction of trench domains, re-meshing is repeatedly performed using a Sandia-developed mesh-generation toolkit, CUBIT, and re-mapping is done with Sandia's utility program, MAPVAR.
机译:电沉积是在LIGA一个关键过程(光刻,Galvanoformung,Abformung - 德语词语的光刻,电镀和模塑)的微细加工,这是日益证明是用于制造微器件或部件一种可行的技术。 LIGA电沉积涉及复杂的多物理现象:1)扩散,迁移,并且在厘米级电解质浴区域和微米级特征的空腔或沟槽区域带电物质的对流; 2)均相和非均相电化学反应;和3)移动沉积表面或在其上的金属离子(例如Ni〜(2+))被电化学还原,以形成纯金属或合金的表面。在本文中,我们报告对发展中LIGA微电模拟预测多维计算机模型的努力。明确地描述了电解质电位A泊松方程通过组合物种质量守恒方程和电中性约束的。即采用任意拉格朗日 - 欧拉制剂网状运动方程,和物种质量,电荷和动量守恒方程在并行计算使用GOMA解决。 GOMA是开发并在Sandia国家实验室得到加强的多物理多维有限元计算机代码。另外,在本工作中,均相反应被认为是无限快的,而沉积表面上的金属离子的还原反应被假定服从巴特勒 - 沃尔默动力学。样品结果示于电解质电位,组分浓度,流场,并在二维沟槽镍电沉积表面的位置上。为了处理沟域的急剧减少,重新网格化使用桑迪亚国家实验室研制的网格生成工具包,CUBIT,并重新映射与桑迪亚国家实验室的实用程序,MAPVAR做重复执行。

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