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Copper-Mediated C-H Bond Arylation of Arenes with Arylboronic Acids

机译:铜介导的C-H粘结芳基芳基硼酸的胶粘剂

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The development of new methods for making privileged biaryl motif has been a topic of immense scientific importance in chemical synthesis. Recently, the direct C-H bond arylation of arenes has become a rapidly growing area of extensive research. In the C-H bond arylation of aromatic compounds, the metalation of C-H bond has been recognized as a key step. Our strategy has been to establish a distinct nucleophile-electrophile interaction between an arene and a transition metal, thereby promoting electrophilic arene metalation. Previous work from our laboratory demonstrated that a rhodium complex bearing extremely π-accepting P[OCH(CF3),]3 as a supporting ligand can catalyze the C-H bond arylation of arenes with iodoarenes. As an alternative to using a neutral ligand, we surmised that the use of electron-withdrawing anionic ligand would also facilitate aromatic C-H bond arylation. After an extensive screening of metal salts based on such a scenario, we found that Cu(OCOCF3)2 alone can facilitate the C-H bond arylation of electron-rich arenes with arylboronic acids.
机译:制定特权的Biaryl主题的新方法是在化学合成中巨大的科学意义的主题。最近,竞技的直接C-H键凝胶化已成为广泛研究的快速增长。在芳族化合物的C-H键芳基化合物中,C-H键的金属化已被认为是关键步骤。我们的策略已经在芳烃和过渡金属之间建立了不同的亲核官能亲电相互作用,从而促进亲电芳烃金属化。我们实验室的以前的工作证明,作为支撑配体作为支撑配体,铑络合物轴承极其接受的P [OCH(CF3),] 3可以催化与碘化物的C-H键凝胶化。作为使用中性配体的替代方案,我们抑制了吸电子阴离子配体的使用也将促进芳族C-H键芳基化。在基于这样的场景的基于这种情况进行广泛筛选金属盐之后,我们发现单独的Cu(ococf3)2可以促进富含芳族硼酸的富含电子的C-H键的芳苯。

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