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Retarding field analysis of the time averaged and time resolved ion energy distribution in pulsed plasmas

机译:脉冲脉冲等离子体中的时间平均和时间分辨离子能量分布的延迟现场分析

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Pulsed plasma discharges are commonly used for materials processing. Several types of pulsed plasma reactors exist. Magnetron sputtering devices are commonly used for thin film deposition, where the target and/or substrate are driven with a pulsed direct current bias at frequencies up to 500 kHz. Pulsed radio-frequency discharges are now being developed for processes such as plasma etching. The plasma source and/or substrate bias may be pulsed independently or synchronously in the kHz to 10's of kHz frequency range. Retarding field energy analysis of the time resolved ion energy distribution functions in these types of pulsed plasmas are discussed. Time resolved ion energy distribution measurements, with time resolution of the order of 100ns, are presented for a range of pulsed plasma configurations.
机译:脉冲等离子体放电通常用于材料加工。存在几种类型的脉冲血浆反应器。磁控溅射装置通常用于薄膜沉积,其中靶和/或基板以高达500kHz的频率的脉冲直流偏压驱动。现在正在为诸如等离子体蚀刻的过程开发脉冲射频放电。等离子体源和/或衬底偏置可以在KHz频率范围的KHz至10的KHz至10的kHz至10的kHz到10的脉冲中脉冲。讨论了延迟现场能量分析这些类型的脉冲等离子体中的分辨离子能量分布函数的时间。时间分辨的离子能量分布测量,随着时间的推移,在一系列脉冲等离子体配置中呈现100ns的时间分辨率。

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