Modeling of material removal for fixed abrasive CMP

摘要

This paper presents results on the dependencies of removal rate during fixed abrasive CMP on abrasive diameter, distance between two abrasives at an asperity, pattern density, pressure, and relative speed between the pad and the wafer. The model is based on the assumption of plastic deformation at the wafer-abrasive interface. The dependence of removal rate on pressure is nonlinear, and hence deviates from Preston's equation. The proposed model predicts a decrease in removal rate as the fraction of high area increases, which is the trend observed experimentally.