Application of the thermal network method to the thermal analysisof thermal printer heads used in high speed thermal printers

摘要

The thermal network method was applied to the analysis of thermalheads used in high-speed printers, and the relationships among pertinentvariables were obtained. These include heating duration and appliedpower, which can be more easily measured than temperature. Therelationships are exhibited by varying the protective layer thickness asexample parameter. It was found that the thermal network method is avery useful tool for preliminary thermal design of a head due to itssimplicity and that the effects of a parameter such as the protectivelayer thickness on the thermal performance of the head become strongerfor a shorter heating duration. This means that thermal analysis is ofspecial importance in designing high-speed thermal printers