Low temperature co-fired glass-ceramic, high-density-interconnect,substrate with improved thermal management

摘要

A hybrid integrated regulator/modulator with a digital and analogsignal bus system for power conditioning of a transmit/receive modulehaving a density figure of merit of 69 W/in³ and 845 W/lb isdescribed. High-density multichip power conditioning modules weredesigned using the Green Tape system, a low-temperature glass-ceramicsubstrate technology, as the base substrate. The design was fabricated,tested, and delivered for an advanced military application. The authorsdiscuss aspects of this power conditioning circuit, includinghigh-density computer-aided design and packaging concepts, theregulator/modulator system of power conditioning, design guidelines andsubstrate build characteristics of the glass-ceramic material system,thermal management solutions for high-powered chips, and reliability andperformance data on the finished substrate and module